Angled Plasma Torch Silicon Purification

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Solution Overview

Problem

Current silicon purification methods for solar cells face inefficiencies in removing boron and other impurities, particularly due to limitations in the contact area between plasma gas and silicon melt surface, which affects the purification efficiency.

Innovation Solution

A silicon purification method and device that injects plasma gas at an angle of 20° to 80° to the silicon melt surface, forming elliptical recesses and promoting circulation flow, with multiple plasma torches arranged to increase contact area and maintain a radical-rich plasma zone, enhancing impurity removal efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Use of energy by moving object

If plasma gas is sprayed vertically onto the silicon melt surface, then heating efficiency is improved, but the contact area between plasma gas and melt surface is reduced

Engineering Contradiction:
Improveheating efficiencyVSAvoidcontact area between plasma gas and melt surface
Core Design Contradiction:
Use of energy by moving objectVSArea of stationary object

Solution Approach 1:

The plasma torch is positioned at an angle of 20° to 80° relative to the melt surface rather than vertically, creating a dynamic spray pattern that increases contact area while maintaining heating efficiency through controlled plasma gas flow direction

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The plasma gas spray is directed at an angular dimension rather than perpendicular to the surface, transforming the contact geometry from a point/line contact to a broader area contact across the melt surface

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If multiple plasma torches are used to increase contact area, then purification efficiency is improved, but device complexity increases

Engineering Contradiction:
Improvepurification efficiencyVSAvoiddevice complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The purification process is divided into multiple zones by using several plasma torches positioned at different locations around the crucible, allowing simultaneous treatment of different melt surface areas and improving overall purification efficiency

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Multiple plasma torches are combined in a coordinated arrangement where each torch contributes to the overall purification process, merging their individual effects to achieve enhanced impurity removal while maintaining manageable system complexity

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method significantly improves silicon purification efficiency by increasing the contact area between plasma gas and silicon melt, leading to effective oxidation and removal of impurities, resulting in higher purity silicon with reduced boron concentrations.

Implementation Method 1

oxidative purification is performed to remove boron (B) or contained impurities through heating by plasma arc or plasma gas

Methodology Applied
Scientific EffectOxidation: Oxidation

Implementation Method 2

The plasma arc is generated by applying a direct current through both electrodes in the plasma torch. The generated plasma arc is injected from the nozzle port, which also serves as the anode electrode, of the plasma torch toward the silicon metal loaded in the crucible, thereby heating the silicon metal

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS8778143B2Silicon purification method and silicon purification device
Publication Date: 2014.07.15 ULVAC INC
  • US8778143B2 patent drawing
  • US8778143B2 patent drawing
  • US8778143B2 patent drawing

AI summary

The silicon purification method uses a silicon purification device including at least a crucible for loading a silicon metal and a plasma torch, and purifies the silicon metal by injecting a plasma gas from the plasma torch toward a melt surface of the silicon metal loaded in the crucible in a state where an angle formed by the melt surface and the plasma gas is set in the range of 20° to 80°.