Angled Plate Heat Sink Assembly for Lightweight Cooling
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Solution Overview
Problem
Conventional heat sinks face challenges with heavier weight, limited shape design, and increased carbon emissions due to aluminum extrusion processes, requiring more post-processing and assembly, which complicates design and increases cost.
Innovation Solution
A heat sink unit and assembly featuring integrally formed plate portions with angled connections and protrusions, allowing for reduced weight and cost through sheet metal forming, while maintaining heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If aluminum extrusion process is used for heat sink, then heat dissipation function is achieved, but weight increases and shape design is limited
Solution Approach 1:
The patent changes the manufacturing process parameter from aluminum extrusion to sheet metal stamping, and changes the structural parameter from traditional fin array to plate with protrusions. This allows achieving the same heat dissipation function with reduced weight and improved shape flexibility.
Solution Approach 2:
The heat sink is segmented into a first plate portion and a second plate portion connected at an angle, allowing independent optimization of each portion for heat dissipation and weight reduction respectively.
2Temperature
If aluminum extrusion process is used for heat sink, then heat dissipation structure is formed, but manufacturing complexity and post-processing requirements increase
Solution Approach 1:
The patent merges the heat dissipation structure formation into a single sheet metal stamping process, eliminating the need for separate extrusion, cutting, and assembly operations. The protrusions and plate portions are formed integrally in one step.
Solution Approach 2:
The sheet metal stamping process itself creates the heat dissipation structure without requiring additional post-processing or assembly operations, making the manufacturing process self-sufficient.
3Temperature
If conventional heat sink design is used, then heat dissipation is provided, but design flexibility for size, weight, and shape is reduced
Solution Approach 1:
The patent employs asymmetric design where the first and second plate portions are connected at an angle that is not 0 or 180 degrees, allowing optimization for specific mounting configurations and improving adaptability to different device layouts while maintaining heat dissipation performance.
Solution Approach 2:
The patent transitions from traditional three-dimensional fin structures to a two-dimensional plate structure with protrusions, providing new design freedom in the planar dimensions while maintaining effective heat dissipation surface area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves weight reduction, cost savings, and improved processing flexibility while maintaining heat dissipation efficiency, replacing conventional extruded fins with a more efficient and lightweight design.
Implementation Method 1
a heat sink unit and at least one circuit board assembly. The heat sink unit includes a first plate portion and a second plate portion... the electronic component is disposed on the circuit board and connected to the protrusion
Data Source
AI summary
A heat sink unit includes a first plate portion and a second plate portion. The first plate portion is integrally formed and includes an outer surface, an inner surface and at least one protrusion. The second plate portion is connected to the first plate portion. A first angle between the first plate portion and the second plate portion is between 5 degrees and 175 degrees. The outer surface of the first plate portion is farther from the second plate portion than the inner surface therefrom, and the protrusion is located on the outer surface.