Angled Power Bar Lead Frame for Adaptable IC Packaging
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Solution Overview
Problem
Conventional lead frame and power bar designs are inflexible and require specific configurations for different integrated circuit (IC) specifications, leading to increased design and tooling costs, limited reusability, and inefficiencies in IC packaging, particularly with rising I/O pin demands, which may force newer ICs into higher-cost platforms.
Innovation Solution
A semiconductor device and method utilizing a lead frame with power bars and tie bars that are adaptable to various IC configurations, where power bars extend at a non-zero angle and are electrically isolated from signal leads, allowing for the reuse of inner signal leads without sacrificing structural support or electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If conventional lead frame designs are used with specific IC configurations, then electrical connectivity and structural support are achieved, but adaptability to different device specifications is lost
Solution Approach 1:
The lead frame is divided into separate functional modules: signal leads for I/O connections and a power bar module for power distribution. The power bar is further segmented into multiple power bar leads that can be independently configured. This segmentation allows each module to be optimized independently and reconfigured for different IC specifications without redesigning the entire lead frame.
Solution Approach 2:
The power bar design serves multiple functions: it provides structural support to the lead frame, distributes power to multiple power pads, and maintains electrical isolation between power and signal paths. The modular power bar can be adapted to different power distribution requirements while maintaining the same basic structure, achieving universality across different IC configurations.
2Quantity of substance
If inner leads are sacrificed for structural support and electrical connectivity in power bars, then power distribution is achieved, but the number of available signal leads decreases
Solution Approach 1:
The lead frame structure is segmented into distinct signal leads and power bar leads. The power bar leads are separate from the signal leads, eliminating the need to sacrifice inner signal leads for power bar construction. This segmentation preserves the maximum number of signal leads while providing dedicated power distribution paths.
Solution Approach 2:
The power bar acts as an intermediary structure that provides electrical connectivity between multiple power pads without requiring direct connection through inner signal leads. The power bar leads extend from the power bar to establish electrical connections, serving as a mediator that maintains both power distribution reliability and signal lead availability.
3Productivity
If QFP lead frame designs are used to meet current I/O pin demands, then cost-effectiveness is maintained, but scalability to future I/O pin requirements is limited
Solution Approach 1:
The modular power bar design provides a universal platform that can accommodate different numbers and configurations of power pads. As I/O pin demands increase, the same power bar structure can be reconfigured to support additional power connections without requiring a complete lead frame redesign, enabling scalability while maintaining cost-effectiveness.
Solution Approach 2:
The lead frame design incorporates dynamic configurability through the power bar module, which can be adapted to different power distribution requirements. This dynamic capability allows the lead frame to evolve with increasing I/O pin demands, transitioning from current QFP configurations to future high-density configurations without abandoning the proven cost-effective platform.
Data Source
AI summary
A semiconductor device includes a semiconductor die encapsulated in a package casing and having four main side walls each oriented generally parallel with one of first or second orthogonal directions. Signal leads are electrically coupled to the die and each has an exposed portion that extends from one of the main side walls parallel with one of the first or second directions. One or more power bars are electrically coupled to the die and each has at least one power bar lead extending at a non-zero angle with respect to the first and second directions. The power bars and associated power bar leads are electrically isolated from the signal leads. One or more tie bars extends at a generally non-zero angle with respect to the first and second directions and is electrically isolated from the signal leads and the power bars and associated power bar leads.