Angled Power Module Components for High Density
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Solution Overview
Problem
Existing power modules face challenges in increasing power density without expanding their outer dimensions, and they often require significant space for wire bonding connections, which can lead to increased electrical resistance.
Innovation Solution
A power module design where rectangular electrical power components are arranged on a substrate with angled sides relative to the substrate's edges, allowing for compact placement and efficient wire bonding connections without increasing the module's outer dimensions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rectangular electrical power components are arranged with sides orthogonal to substrate edges, then manufacturing and alignment are simplified, but power density cannot be increased without increasing outer dimensions
Solution Approach 1:
The patent applies asymmetry by rotating the rectangular electrical power components at an angle (e.g., 45 degrees) relative to the substrate edges, breaking the conventional orthogonal alignment. This asymmetric arrangement allows more components to be packed into the same footprint area, increasing power density without increasing outer dimensions, while still maintaining manufacturability through defined angular relationships.
Solution Approach 2:
The patent transitions from conventional orthogonal (axis-aligned) arrangement to angular arrangement, effectively utilizing the angular dimension between component sides and substrate edges. This dimensional change in orientation allows optimized space utilization and higher component density within the same rectangular footprint.
2Quantity of substance
If more electrical power components are packed into the same area, then power density increases, but space for wire bonding connections is reduced
Solution Approach 1:
By arranging components at angular orientations rather than orthogonal alignment, the patent creates asymmetric spacing patterns that optimize both component density and connection space. The angular arrangement naturally distributes components in a pattern that maintains adequate wire bonding access while maximizing packing efficiency.
Solution Approach 2:
The patent applies local quality by allowing different regions of the substrate to have different component arrangements and spacing. Areas requiring wire bonding connections maintain appropriate spacing and access, while other areas maximize component density, creating locally optimized zones throughout the module.
3Quantity of substance
If rectangular power components are arranged at angles to substrate edges, then power density increases and wire bonding is facilitated, but manufacturing complexity increases
Solution Approach 1:
The patent changes the angular parameter of component arrangement from the conventional 0 degrees (orthogonal) to specific angles such as 45 degrees. This parameter change increases power density and facilitates wire bonding while maintaining manufacturability through well-defined angular relationships that can be programmed into manufacturing equipment.
Solution Approach 2:
The patent may divide the substrate into multiple zones or groups of components with consistent angular orientations, making the complex arrangement more manageable for manufacturing. Each zone can be processed independently with standardized angular relationships, reducing overall manufacturing complexity.
Data Source
AI summary
A power module (2) including a plurality of rectangular electrical power components (4, 4′) arranged on a substrate (6). The sides of at least a subset of the rectangular electrical power components (4, 4′) are not orthogonal to a line (12, 12′) that passes through the geometric centre (C) of the rectangular electrical power components (4, 4′) of the subset and extends orthogonal to a side (L, M) of the substrate (6).