Angled Protection Component in LED Device
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Solution Overview
Problem
Conventional LED devices face issues with luminous efficiency due to light absorption by protection components and decreased yield rates during manufacturing, as the protection components can be damaged by high-speed, high-temperature plastic material during housing formation.
Innovation Solution
The protection component is positioned on a lead frame such that none of its sides are parallel or perpendicular to the extending direction of the lead frame, allowing the plastic material to bypass it and reducing the risk of damage, while maintaining electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the protection component is disposed in the receiving portion of the LED device, then it provides current vent path protection, but it absorbs light and deteriorates luminous efficiency
Solution Approach 1:
The protection component is extracted from the light-emitting region and relocated to a position outside the receiving portion, specifically arranged alongside the lead frame. This separation ensures the protection component no longer absorbs light from the LED chip, eliminating the luminous efficiency deterioration while preserving its current vent path protection function.
2Ease of manufacture
If the protection component is disposed with a side parallel to the frame, then it is easy to manufacture, but the plastic material damages the conductive adhesive bonding and causes protection component failure
Solution Approach 1:
The protection component is disposed at an angled orientation relative to the lead frame rather than parallel alignment. Specifically, the protection component forms an angle θ (where 0° < θ < 90°) with the lead frame, creating an asymmetric arrangement that allows plastic material to flow around it during injection molding, preventing damage to the conductive adhesive bonding and ensuring reliability.
3Ease of manufacture
If the protection component is disposed parallel to the lead frame, then the manufacturing process is simple, but the yield rate of modeling decreases due to resistance to plastic material flow
Solution Approach 1:
By arranging the protection component at an angled orientation θ (where 0° < θ < 90°) relative to the lead frame, the design creates an asymmetric configuration that reduces resistance to plastic material flow during injection molding. This angular disposition allows the plastic to flow more smoothly around the protection component, increasing the yield rate of molded LED device products while maintaining manufacturing simplicity.
Data Source
AI summary
A LED device is provided. The LED comprises a frame, a housing, a LED chip and a protection component. The frame comprises a first lead frame and a second lead frame disposed along a first direction and isolated from each other. The housing partially covers the first and second lead frames, and has a receiving portion exposing parts of the surfaces of the first and second lead frames. The LED chip is disposed in the receiving portion on the exposed surface of the first lead frame, and electrically connected to the first and second lead frames. The protection component is disposed on a surface of the second lead frame that is covered by the housing and electrically connected to the first lead frame. None of the sides of a vertical projection of the protection component on the second lead frame is parallel or perpendicular to the first direction.