Angled Semiconductor Chip Resin Sealing Void Suppression

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Solution Overview

Problem

Existing semiconductor devices face issues with void formation and reliability due to inadequate resin sealing around the semiconductor chip, particularly when the electrode layer is not properly aligned during dicing, leading to cracks and reduced device reliability.

Innovation Solution

The semiconductor device design features a semiconductor chip with specifically angled side surfaces and scallops, where the resin is in contact with these surfaces, ensuring effective sealing and minimizing void formation through a manufacturing process involving isotropic and anisotropic etching techniques to create inverse tapered shapes and small pitch scallops, enhancing resin contactability and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional dicing is used without proper electrode layer alignment, then manufacturing is simpler, but void formation occurs and reliability decreases

Engineering Contradiction:

Improvedevice reliabilityVSAvoidmanufacturing process complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The electrode layer is aligned and positioned before the dicing process to ensure proper alignment with the semiconductor chip. This preliminary alignment action prevents void formation during subsequent resin sealing, resolving the contradiction by preparing the structure in advance to avoid reliability issues without requiring complex real-time adjustments during manufacturing

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The semiconductor chip is designed with a localized stepped structure where only specific portions have different heights, creating local variations in surface level. This local quality change allows the resin to properly seal around the electrode layer without requiring complete restructuring of the entire device, thus improving reliability while maintaining manufacturing simplicity

Inventive Principle:

Principle #3Local quality

2Reliability

If the semiconductor chip has a flat surface, then manufacturing is easier, but resin contact is insufficient leading to void formation

Engineering Contradiction:

Improvesealing qualityVSAvoidsurface geometry precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The semiconductor chip surface is segmented into multiple levels with different heights, creating a stepped structure. This segmentation allows the resin to contact different surface levels, ensuring comprehensive sealing without requiring extremely precise flat surface control, thus improving sealing quality while maintaining reasonable manufacturing precision requirements

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The chip side surfaces are formed with angled and curved geometries rather than flat planes, creating inverse tapered shapes that facilitate resin flow and contact. This curvature application improves resin penetration and sealing effectiveness without requiring ultra-precise flat surface manufacturing

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Reliability

If scallops are formed with large pitch, then manufacturing is simpler, but resin insertion is inadequate causing voids

Engineering Contradiction:

Improveresin sealing effectivenessVSAvoidscallops formation complexity

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The scallop pitch parameter is optimized to a specific small range to ensure adequate resin insertion while maintaining manufacturability. This parameter change balances the competing requirements of sealing effectiveness and manufacturing ease, resolving the contradiction by finding the optimal pitch value that satisfies both constraints

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures satisfactory resin insertion and contact with the chip surfaces, suppressing void formation and enhancing the reliability of the semiconductor device by improving the sealing process and reducing the likelihood of cracks, thereby providing a more reliable semiconductor device.

Implementation Method 1

a first gap 74 having a first side surface portion 12 is formed by performing first etching of a first portion 72 of the semiconductor substrate

Methodology Applied

Scientific EffectIsotropic etching:

Implementation Method 2

a second gap 78 having an inverse tapered shape and having a second side surface portion 16 is formed by performing second etching of a second portion 76 of the semiconductor substrate

Methodology Applied

Scientific EffectAnisotropic etching:

Data Source

PatentUS11587840B2Semiconductor device and manufacturing method thereof

Publication Date: 2023.02.21 KK TOSHIBA

AI summary

Provided is a semiconductor device including: a substrate; an electrode layer provided on the substrate; a semiconductor chip being provided on the electrode layer, including a first side surface portion having a first angle with respect to a substrate surface of the substrate, and including a second side surface portion being provided below the first side surface portion and having a second angle smaller than the first angle with respect to the substrate surface; and a resin being provided around the electrode layer and the semiconductor chip and being in contact with the first side surface portion and the second side surface portion.