Angled Sensor Die Package for Compact Medical Device Positioning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
There is a challenge in developing compact integrated device packages that can be used in small spaces, such as within a body lumen or a catheter, to accurately monitor the location and orientation of medical devices, particularly due to the limited space and heat dissipation requirements.
Innovation Solution
The solution involves an integrated device package with a package substrate, two sensor dies angled relative to each other by a fixed non-parallel angle, and a molding material to maintain this angle, along with a bracket assembly for stiffness, which includes magnetoresistance sensors to sense position along multiple axes and a processing die for data processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If sensor device dies and electronics are incorporated into the catheter system, then position sensing capability is improved, but the device diameter increases beyond the limit of small blood vessels
Solution Approach 1:
The patent embeds the sensor device dies and electronics within the catheter structure itself, nesting the sensing components inside the existing catheter lumen. This allows position sensing capability to be integrated without significantly increasing the overall device diameter, enabling the system to fit within small blood vessels while maintaining sensing functionality.
Solution Approach 2:
The patent angles the sensor device dies relative to each other (e.g., 90 degrees) to sense position along multiple axes. By orienting sensors in different dimensional directions rather than simply increasing sensor size, the system achieves three-dimensional position sensing capability within a compact cylindrical form factor that fits within the catheter diameter constraints.
2Measurement precision
If sensor device dies are used to monitor location and orientation, then measurement precision is improved, but heat generation increases which is harmful when used in the human body
Solution Approach 1:
The patent separates the high-power processing electronics from the sensor device dies. The sensor dies themselves consume minimal power and generate negligible heat, while the bulk of power consumption and heat generation occurs in the external processing system. This extraction of the power-intensive components from the implanted sensor package eliminates the heat generation problem at the patient site while maintaining measurement precision.
3Measurement precision
If multiple sensor dies are mounted to sense position along multiple axes, then measurement precision is improved, but device complexity increases
Solution Approach 1:
The patent uses identical sensor device dies for multiple sensing functions. The same basic sensor die design can sense position along different axes when oriented at different angles, eliminating the need for multiple specialized sensor types or complex mounting mechanisms. This universal sensor approach reduces device complexity while achieving three-dimensional position sensing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise three-dimensional position detection of medical devices within the body, allowing for accurate placement and orientation, while minimizing heat generation and fitting within small anatomical spaces.
Implementation Method 1
The sensor dies can include magnetoresistance sensors, such as, for example, anisotropic magnetoresistance (AMR) sensors, tunneling magnetoresistance (TMR) sensors, and giant magnetoresistance (GMR) sensors.
Data Source
AI summary
An integrated device package sized and shaped to fit in a small space, such as within a body lumen or cavity of a human patient, is disclosed. The integrated device package includes a package substrate and integrated device dies. The first and second integrated device dies are angled relative to one another about the longitudinal axis by a fixed non-parallel angle.


