Angled Showerhead Faceplates for Uniform Wafer Gas Distribution
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Solution Overview
Problem
Current semiconductor processing showerheads lack the ability to efficiently distribute gases across the wafer surface, leading to non-uniform processing and increased costs due to the need for multiple gas distribution plates and faceplates for different processes.
Innovation Solution
The design of a showerhead faceplate with angled gas distribution passages that extend from one side to the opposite side, allowing for adjustable gas flow patterns without requiring modifications to the gas distribution plate, enabling adaptation for various processing conditions and improving wafer edge uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional vertical gas distribution passages are used, then the showerhead structure is simple and easy to manufacture, but the gas distribution uniformity across the wafer surface is poor
Solution Approach 1:
The patent applies local quality by varying the orientation of gas distribution passages in different spatial regions. Specifically, passages in the first annular region are angled at a first angle relative to the wafer normal, while passages in the second annular region are angled at a different second angle. This regional variation in passage orientation optimizes gas distribution uniformity across different zones of the wafer surface, addressing the non-uniformity problem caused by traditional uniform vertical passages.
Solution Approach 2:
The patent employs asymmetry by introducing angled passages rather than uniform vertical passages. The passages are configured with specific angles relative to the wafer normal, creating an asymmetric flow pattern that compensates for edge effects and improves gas distribution uniformity across the wafer surface, particularly at the edges where traditional symmetric vertical passages fail to provide adequate coverage.
2Adaptability or versatility
If multiple gas distribution plates and faceplates are used for different processes, then various processing conditions can be met, but the system complexity and cost increase
Solution Approach 1:
The patent implements universality by designing a single gas distribution plate with multiple annular regions containing passages at different angles. This unified structure can accommodate various processing conditions by selectively utilizing different passage regions or adjusting flow rates to different regions, eliminating the need for multiple separate gas distribution plates and faceplates for different processes, thus reducing system complexity and cost while maintaining versatility.
Solution Approach 2:
The patent applies dynamics by enabling flexible control of gas flow distribution across different annular regions. The system can dynamically adjust gas flow rates to specific passage regions based on processing requirements, allowing a single gas distribution plate to adapt to various processing conditions that previously required multiple fixed-configuratio
Data Source
AI summary
Showerhead faceplates for semiconductor processing chambers are provided that include one or more sets of gas distribution passages therethrough that extend at least partially along axes that are at an oblique angle to the showerhead faceplate center axis. Such angled gas distribution passages may be used to tailor the gas flow characteristics of such showerhead faceplates to produce various desired gas flow behaviors in the gas that is delivered to the wafer via such showerhead faceplates.