Angled Sidewall Substrate for Seamless Micro-LED Display Splicing
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Solution Overview
Problem
Existing display technologies face challenges in creating seamless large-sized displays due to visual perception issues from splicing seams and inefficiencies in micro-LED manufacturing, where high precision tools are required for large-scale production, leading to increased costs and reduced yield.
Innovation Solution
A display panel design where a first substrate with a non-180° angled sidewall connects to a light output surface, featuring patterned conductive layers for electrical connections between light-emitting elements on multiple substrates, allowing for seamless splicing and the use of additional light-emitting elements on seams to minimize visual impact and enhance processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If multiple substrates are spliced together to form a large-sized display panel, then the display size is increased, but visual perception issues arise due to splicing seams
Solution Approach 1:
The patent extracts the harmful conductive layer from the visual field by positioning it on the sidewall rather than the light output surface. The conductive layer is removed from areas where it would be visible, eliminating the visual impact of splicing seams while maintaining its electrical connection function across substrate boundaries.
Solution Approach 2:
The patent moves the conductive layer from the two-dimensional light output surface to the three-dimensional sidewall structure. This dimensional transition places the conductive layer outside the visual plane, allowing seamless splicing appearance while preserving electrical connectivity through the angled sidewall configuration.
2Productivity
If a large number of micro-LED dies are transferred at one time, then production capacity is increased, but extremely high precision transferring tools are required which increases cost and reduces yield
Solution Approach 1:
The patent segments the substrate structure into distinct functional zones: a light output surface for displaying elements and an angled sidewall for conducting connections. This segmentation allows independent optimization of each zone, enabling high-capacity transfer tools to focus on the light output surface while the sidewall structure provides tolerance for connection alignment.
Solution Approach 2:
The patent applies different structural qualities to different locations: the light output surface maintains a flat, precise structure for high-density element placement, while the sidewall incorporates an angled design that provides mechanical tolerance and facilitates electrical connection without requiring extreme precision.
3Manufacturing precision
If only a small amount of micro-LED dies are transferred at each time, then transferring precision requirements are reduced, but processing time increases significantly
Solution Approach 1:
The patent prepares the substrate with pre-formed angled sidewalls and conductive layer structures before the micro-LED transfer process. This preliminary structuring creates built-in alignment features and tolerance zones that simplify the transfer operation, allowing faster processing without sacrificing connection precision.
Solution Approach 2:
The patent changes the geometric parameter of the substrate from a conventional flat structure to one with angled sidewalls. This parameter modification alters the transfer process requirements, enabling faster, less precise transfers to achieve the same connection quality that would otherwise require extremely precise, time-consuming operations.
Data Source
AI summary
A display panel includes a first substrate used to connect with at least one other substrate, a plurality of first light-emitting elements and a first patterned conductive layer. The first substrate includes a first light output surface and a first sidewall connecting to the first light output surface, wherein the first sidewall forms a non-180° angle with the first light output surface. The plurality of first light-emitting elements are disposed on the first light output surface. The first patterned conductive layer is disposed on the first sidewall.