Angled SMD Mounting via Segmented PCB Pads
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Solution Overview
Problem
Existing SMD component mounting technologies struggle with automating the placement and soldering of electronic components perpendicular to printed circuit boards, which is necessary for sensitive areas like sensors, due to the complexity of the process and the need for additional components and manual steps.
Innovation Solution
A connecting arrangement with a soldering area designed as two sections connected by a constriction and contact elements with angled contact areas allows for automated mounting and soldering of electronic components at a prespecified angle, utilizing reflow soldering processes to position and tilt the components, reducing the need for additional components and manual steps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If SMD components are soldered parallel to the printed circuit board surface, then automated production is achieved, but components cannot be mounted perpendicular to the board
Solution Approach 1:
The soldering area is divided into two separate sections (first and second sections) connected by a constriction. The contact element has two corresponding contact areas (first and second contact areas) that engage with different sections. This segmentation allows the component to be soldered in two distinct orientations - first parallel to the board, then perpendicular after tilting
Solution Approach 2:
The invention transitions from a single-plane soldering approach to a multi-dimensional approach. The component is first positioned in the horizontal plane (parallel to board), then tilted into the vertical plane (perpendicular to board) by 45° or 90°. The rounded transition region facilitates this dimensional change during the soldering process
2Adaptability or versatility
If components are mounted perpendicular to the printed circuit board, then sensor areas can be oriented correctly, but automated placement and soldering becomes difficult
Solution Approach 1:
The component is first mounted in the easier parallel orientation during the first soldering process, establishing initial solder connections. Then, while the solder is still molten, the component is tilted to the final perpendicular orientation. This preliminary action in the parallel orientation simplifies the automated placement step
Solution Approach 2:
The invention changes the orientation parameter of the component during the soldering process itself. The component transitions from a 0° orientation (parallel to board) to a 45° or 90° orientation (perpendicular to board) by utilizing the molten state of the solder and the rounded transition region that guides the tilting motion
3Adaptability or versatility
If additional components and manual steps are used to mount perpendicular components, then perpendicular mounting is achieved, but process complexity and cost increase
Solution Approach 1:
The invention combines the mounting and orientation functions into a single integrated soldering process. The specialized soldering area with two sections and the contact element with two contact areas work together to achieve both parallel mounting and subsequent perpendicular tilting in one automated process, eliminating the need for separate mounting steps, auxiliary components, or manual intervention
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables automated mounting and soldering of electronic components perpendicular to the printed circuit board, reducing resource usage and manual steps, allowing for cost savings and improved component placement on two planes, including 90° orientation.
Implementation Method 1
Since the components are held only by surface tension and adhesive forces of the soldering paste during the soldering processes
Implementation Method 2
Since the components are held only by surface tension and adhesive forces of the soldering paste during the soldering processes
Data Source
AI summary
A connecting arrangement includes an electronic component and a printed circuit board, and a method includes establishing a solder connection between the component and circuit board. The component has a housing with a support area, and a contact element with a first contact area running parallel to the support area of the housing, a second contact area at a prespecified angle relative to the first contact area, and a rounded transition region formed between the first and second contact areas. The circuit board has a first surface with a soldering area including a constriction, a first section, and a second section connected to the first section via the constriction. The transition region is in a region of the constriction. The second contact area is connected to the second section via a solder connection. The support area is at an angle relative to the first surface corresponding to the prespecified angle.