Angled Spring Plate Welding in Thin Electronic Housings
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Solution Overview
Problem
The internal thickness space of electronic devices cannot meet the requirement of the welding length between the spring plate and the metal portion due to the increasing trend towards lighter and thinner designs, affecting the device's lightness and thinning.
Innovation Solution
The electronic device incorporates a spring plate with a welding portion and a contact portion forming an obtuse or acute angle, allowing for increased welding length without increasing the device's thickness, and includes a reinforcing block to enhance structural strength and avoid component interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the welding length between the spring plate and the metal portion is increased to meet welding dimension requirements, then the welding strength is improved, but the thickness dimension of the electronic device must be increased, affecting lightness and thinning
Solution Approach 1:
The welding portion of the spring plate is designed to be obliquely disposed relative to the metal portion, changing the welding configuration from a perpendicular arrangement to an inclined arrangement. This dimensional change allows the welding length to extend along the inclined surface rather than requiring increased thickness space, thereby achieving sufficient welding strength without increasing the device's thickness dimension
Solution Approach 2:
An inclined surface is introduced on the metal portion to accommodate the oblique welding portion of the spring plate. This curved or angled surface geometry enables the welding portion to contact the inclined surface at an optimal angle, maximizing the welding length within the available thickness space and improving welding strength without requiring additional thickness
2Length of stationary object
If the spring plate is disposed obliquely to increase welding length, then the welding dimension requirement is met, but the welding portion may conflict with electronic components inside the device
Solution Approach 1:
The inclined surface is localized to a specific region on the metal portion where welding is required, rather than making the entire structure inclined. This localized geometric modification allows the welding portion to achieve the necessary inclined configuration for sufficient welding length while keeping other areas of the device structure simple and free from component interference
Solution Approach 2:
The spring plate is divided into distinct functional portions: a welding portion designed for oblique welding to the metal portion, and a contact portion that remains parallel to the mainboard. This segmentation allows each portion to be optimized independently - the welding portion can be inclined to achieve sufficient welding length while the contact portion maintains its original configuration to avoid interfering with electronic components
Data Source
AI summary
This application provides an electronic device, and relates to the field of electronic device technologies, to resolve a problem that an internal thickness space of the electronic device cannot meet a requirement of a minimum welding length between the spring plate and the metal portion. The electronic device includes a housing, a mainboard, and the spring plate. The housing includes a bezel and a back cover, and the back cover is fixedly connected to the bezel. The mainboard is disposed in the housing. The spring plate includes a welding portion and a contact portion, where the welding portion is bonded to and fixed, by welding, to the bezel, and the contact portion is electrically connected to the mainboard. The contact portion is parallel to the mainboard, an included angle a is formed between the welding portion and the contact portion, and the included angle a is an obtuse angle or an acute angle.