Angled Spring Probe Contactor for IC Contact
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Solution Overview
Problem
Conventional spring probe contactors face challenges in achieving reliable electrical contacts with IC device contact pads/solder balls due to foreign material layers, leading to increased contact resistance and retesting costs, especially with high-density IC packages.
Innovation Solution
The design features angled spring probes that swipe across the contact pads/solder balls, allowing penetration with lower contact force, and includes multiple arrays oriented at different angles to accommodate various pad/solder ball patterns, balancing lateral forces and improving conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If spring probes contact the DUT's contact pads perpendicularly at 90 degrees, then the contact structure is simple and easy to manufacture, but the contact resistance increases due to difficulty in penetrating foreign material layers
Solution Approach 1:
The spring probes are angled at 45 degrees relative to the perpendicular z-axis, creating an asymmetric contact approach. This angular orientation allows the probe tips to swipe across the contact pad surfaces at an angle, effectively penetrating foreign material layers that would block perpendicular contacts. The asymmetric angle transforms the contact mechanism from a direct vertical insertion to a diagonal swiping motion, improving penetration capability while maintaining manufacturing simplicity.
2Reliability
If higher spring force is applied to penetrate foreign material layers, then the electrical contact reliability improves, but the contactor requires more force which increases complexity and cost
Solution Approach 1:
The invention introduces an angular dimension to the contact approach, changing from a one-dimensional perpendicular contact to a two-dimensional angled contact. By orienting spring probes at 45 degrees, the contact action occurs both vertically (z-axis) and laterally (x-y plane), creating a swiping motion that enhances penetration through foreign materials. This dimensional change allows effective contact with reduced spring force compared to traditional perpendicular approaches.
3Device complexity
If conventional perpendicular spring probes are used, then the contactor design is simple, but retesting and rejection of IC devices increases due to poor contact
Solution Approach 1:
The 45-degree angled spring probes create an asymmetric contact geometry that improves penetration through foreign material layers on contact pads and solder balls. This asymmetric angular approach transforms the contact mechanism into a swiping action that effectively removes or penetrates contaminant layers, reducing contact resistance and improving first-pass yield. The design maintains simplicity while significantly reducing retesting and rejection rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables reliable electrical contacts with reduced spring force, minimizing retesting and rejection of IC devices, while accommodating diverse IC package configurations and enhancing probe conductivity.
Implementation Method 1
A plurality of spring probes (pogo-pins) provided in the interface wall have probe tips that extend beyond the faces of the contactor
Data Source
AI summary
A spring probe contactor includes an angled spring probe configuration that causes the tips of the spring probes to “swipe” the contact pads/solder balls of an IC device under test as the contacts are made. The angulation of the spring probes permit penetration through foreign material layers on the pad/ball surfaces with less contact force.