Angled-Substrate Scintillator Panel for Damage-Resistant Detector Assembly

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Solution Overview

Problem

The assembly of scintillator panels with photo-detection substrates requires multiple steps and can cause damage to the scintillator panels during handling and bonding, leading to inefficiencies and potential damage.

Innovation Solution

The scintillator panel is designed with a substrate and scintillator layer having a non-perpendicular angle, allowing for easy cutting and molding into arbitrary shapes, and incorporating a barrier layer to protect the scintillator layer from moisture and impact, with a protective film enhancing adhesion and reducing air bubble accumulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the scintillator panel is molded to have a predetermined shape and then bonded to a photo-detection substrate, then the radiation detector can be manufactured, but multiple steps of work are required and damage to the scintillator panel during assembly work occurs

Engineering Contradiction:
Improveease of assemblyVSAvoiddamage during handling
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The substrate and scintillator layer are combined into a single integrated scintillator panel structure, where the substrate serves both as a structural base and as part of the bonding interface. This integration eliminates separate handling of the scintillator layer, reducing damage risk during assembly while maintaining manufacturing feasibility.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The scintillator panel is pre-formed with the substrate and scintillator layer integrated before assembly with the photo-detection substrate. This preliminary integration of critical components reduces the number of subsequent handling steps and minimizes exposure to damage during the assembly process.

Inventive Principle:
Principle #10Preliminary action

2Adaptability or versatility

If the scintillator layer is cut using a paper cutter to obtain a desired shape, then the scintillator panel can be formed, but the scintillator layer is vulnerable to impact damage

Engineering Contradiction:
Improveshape customizationVSAvoidresistance to impact
Core Design Contradiction:
Adaptability or versatilityVSStrength

Solution Approach 1:

The substrate provides localized structural support and protection to the scintillator layer, particularly at the boundaries and cut edges where vulnerability to impact is highest. The substrate acts as a protective frame that maintains the integrity of the scintillator layer while allowing shape customization.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design reduces damage during assembly, improves adhesion, and facilitates easy integration with photo-detection substrates, enhancing the reliability and efficiency of radiation detectors.

Implementation Method 1

A scintillator panel emits scintillation light in response to radiation incident on the scintillator layer

Methodology Applied
Scientific EffectScintillation: Scintillation

Data Source

PatentEP3690897B1Radiation detector comprising a scintillator panel
Publication Date: 2025.08.06 HAMAMATSU PHOTONICS KK
  • EP3690897B1 patent drawingFigure 1
  • EP3690897B1 patent drawingFigure 2
  • EP3690897B1 patent drawingFigure 3(a)~3(d)

AI summary

A scintillator panel 10 includes a substrate 11 having a substrate main surface 11a, a substrate rear surface 11b, and a substrate side surface 11c; and a scintillator layer 12 having a scintillator rear surface 12b formed of a plurality of columnar crystals, a scintillator main surface 12a, and a scintillator side surface 12c. The substrate side surface 11c and the scintillator side surface 12c are substantially flush with each other. In the substrate 11, an angle A1 between the substrate rear surface 11b and the substrate side surface 11c is smaller than 90 degrees.