Angled Supercapacitor Circuit Layout for PCB Moisture Control
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Solution Overview
Problem
Heat and humidity accumulation in confined spaces between surface-mounted supercapacitors and PCBs can cause corrosion and damage, leading to issues such as hydrogen gas and water vapor infiltration.
Innovation Solution
The supercapacitor assembly is configured with an angle between its longitudinal direction and the substrate's planar surface, reducing heat and humidity accumulation, and the use of a hermetically sealed housing with specific materials and seals to prevent leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If supercapacitors are surface mounted to provide significant energy storage in a small form factor, then energy density is improved, but heat and humidity accumulation occurs in confined spaces causing corrosion and damage
Solution Approach 1:
The patent introduces a third dimension by angling the supercapacitor assembly relative to the PCB surface. Instead of mounting the supercapacitor parallel to the PCB (2D configuration), the assembly is tilted at an angle between 15-45 degrees, creating vertical spacing that allows heat and humidity to escape. This dimensional change transforms the confined 2D space into a ventilated 3D structure, resolving the heat accumulation problem while maintaining the compact form factor.
2Reliability
If electrical leads are used to connect supercapacitors to PCBs, then electrical connection is achieved, but heat generation and electrolysis reactions occur causing gas infiltration and damage
Solution Approach 1:
The patent extracts the electrical connection function from traditional wire leads and relocates it to the supercapacitor assembly terminals. By integrating the connection points directly into the angled assembly structure, the patent eliminates the need for separate leads that generate heat and cause electrolysis. The connection is achieved through the assembly's terminal structure itself, removing the harmful intermediate component.
3Object-affected harmful factors
If the supercapacitor assembly is positioned at an angle to the substrate, then heat and humidity accumulation is reduced, but manufacturing complexity increases
Solution Approach 1:
The patent merges the mounting function with the thermal management function by integrating the angled positioning directly into the assembly structure. The assembly includes both the supercapacitor and the angled mounting features as a single integrated unit, eliminating the need for separate mounting brackets or adjustment mechanisms. This consolidation simplifies manufacturing while achieving the desired angular orientation for heat dissipation.
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3B
AI summary
An electrical circuit is provided including a substrate having a generally planar surface. A supercapacitor assembly includes a container having a length in a longitudinal direction. The supercapacitor assembly includes an electrode assembly enclosed within the container, and the electrode assembly may have a jelly-roll configuration. An angle ranging from about 0 to about 30 degrees is formed between the longitudinal direction of the container and the generally planar surface of the substrate.