Angular Sensor PCB Mounting via Flexible Polymer Connection
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Solution Overview
Problem
The existing methods for mounting an additional carrier on a main printed circuit board in vehicle dynamics control systems are complex, expensive, and prone to alignment errors and measurement errors due to high vibration levels, requiring separate production and bonding of two circuit carriers and often resulting in concealed mounting issues.
Innovation Solution
The additional carrier is designed as a printed circuit board area connected to the main printed circuit board via flexible, elastic connection areas with conductor tracks, allowing for direct and rapid assembly using a holder that positions and fixes the carrier securely in a desired angular position, eliminating the need for additional electrical connections and cables.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an additional carrier is mounted separately on the main printed circuit board, then the sensor can be attached in a vertical position, but the production becomes complex and expensive requiring two separate circuit carriers to be produced and assembled
Solution Approach 1:
The patent merges the additional carrier and main printed circuit board into a single integrated circuit board structure. The sensor is mounted vertically on the circuit board with its support structure integrated directly into the same board, eliminating the need for separate production and assembly of two distinct carriers. This integration maintains the vertical mounting capability while simplifying the manufacturing process to a single board production cycle.
2Reliability
If bonding is used to secure the additional carrier, then backlash-free attachment is achieved, but the production process becomes more complex and time-consuming
Solution Approach 1:
The patent replaces the bonding process with a mechanical mounting system. The support structure for the vertical sensor is integrated into the circuit board with mechanical features such as recesses, tabs, or snap-fit mechanisms that secure the sensor in place without requiring adhesive bonding. This mechanical approach achieves stable, backlash-free attachment while significantly reducing assembly time and process complexity.
3Measurement precision
If the additional carrier is aligned separately, then the sensor can be positioned correctly, but alignment errors lead to measurement errors
Solution Approach 1:
By integrating the support structure directly into the circuit board, the patent eliminates the separate alignment step between two independent carriers. The vertical sensor and its support are positioned as a single unit during board fabrication, ensuring precise alignment. This integrated approach guarantees that the sensor maintains the correct angular relationship with the board, preventing measurement errors that would arise from misalignment between separate components.
4Strength
If a holder is attached to mechanically secure the carrier, then the attachment is strengthened, but concealed mounting becomes problematic
Solution Approach 1:
The patent integrates the holder or support structure directly into the circuit board fabrications process. The mechanical securing features are built into the board itself through molding, PCB lamination, or integrated mounting structures, rather than being added as separate concealed components. This integration provides strong mechanical security for the vertically mounted sensor while eliminating the complexity of concealing separate holder components within the assembly.
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The module (1) has a holder (12) for fixing an auxiliary carrier (5) at a main printed circuit board (2) at an angle, where the carrier has a component (6a) i.e. sensor, that stands in electric contact with the main printed circuit board. The carrier is formed as an auxiliary printed circuit board, and a strip conductor (3) runs in the auxiliary printed circuit board. The circuit boards are connected with each other over a flexible connection area (8), and the conductor runs to the main printed circuit board via the connection area, where the connection area is made of polymer layer. An independent claim is also included for a method for manufacturing a sensor module.