Unsaturated Cyclic Anhydride End-Capped Polyimides for Low-Temperature Processing
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Solution Overview
Problem
Conventional polyimides and polyamic acid polymers used in microelectronics and optoelectronics often exhibit poor thermo-mechanical properties, require high cure temperatures, and are insoluble in common solvents, limiting their applications due to the use of toxic monomers and poor photo imaging capabilities.
Innovation Solution
Incorporating unsaturated cyclic anhydrides, such as itaconic anhydride, as end-capped groups in polyamic acid and polyimide polymers, which are formed using dianhydrides and diamines, to create compositions that are soluble in organic solvents and exhibit improved thermo-mechanical properties, allowing for lower cure temperatures and enhanced photo-imaging capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional polyimides and polyamic acid polymers are used, then the material provides basic structural properties for microelectronics, but the thermo-mechanical properties are poor and cure temperatures must be very high
Solution Approach 1:
The patent changes the chemical structure parameters of the polymer by incorporating unsaturated cyclic anhydride end caps (such as itaconic anhydride) onto the polyimide chains. This structural modification enables the material to achieve excellent thermo-mechanical properties while dramatically reducing the cure temperature from above 300°C to below 250°C, resolving the contradiction between cure temperature and thermo-mechanical performance
Solution Approach 2:
The invention creates a composite polymer structure combining conventional polyimide chains with unsaturated cyclic anhydride end cap groups. This composite architecture integrates the structural stability of polyimides with the reactive functionality of unsaturated anhydrides, enabling both improved thermo-mechanical properties and lower processing temperatures
2Ease of manufacture
If conventional polyimides are used, then the material provides dielectric properties, but the materials are insoluble in commonly used solvents
Solution Approach 1:
The patent applies local quality modification by adding unsaturated cyclic anhydride end cap groups only at the terminal positions of the polyimide chains, while maintaining the bulk polyimide structure intact. This localized modification confers solubility in common organic solvents without compromising the thermal stability and dielectric properties of the polyimide backbone
Solution Approach 2:
The invention changes the surface chemistry parameters of the polymer by introducing polar unsaturated anhydride groups at the chain ends. This parameter change enhances intermolecular interactions with solvent molecules, improving solubility while the bulk polyimide structure maintains its inherent stability
3Adaptability or versatility
If conventional polyimides are used, then the material provides structural integrity, but photo imaging capabilities are poor
Solution Approach 1:
The unsaturated cyclic anhydride end capped polyimides achieve multi-functionality by combining structural polyimide properties with photo-reactive unsaturated groups. The material simultaneously provides structural integrity for dielectric applications and photo imaging capability through the unsaturated end caps that can undergo photo-induced crosslinking or degradation reactions
Solution Approach 2:
The invention creates a functional composite where the polyimide backbone provides structural integrity and dielectric properties, while the unsaturated cyclic anhydride end caps provide photo imaging functionality. This composite structure enables the single material to fulfill multiple functional requirements
Data Source
AI summary
Embodiments in accordance with the present invention encompass polyamic acid or polyimide polymers containing a reactive unsaturated cyclic anhydride end group as well as photosensitive compositions made therefrom which are useful for forming films that can be patterned to create structures for microelectronic devices, microelectronic packaging, microelectromechanical systems, optoelectronic devices and displays. In some embodiments the compositions of this invention are shown to feature excellent hitherto unachievable mechanical properties. The negative images formed therefrom exhibit improved thermo-mechanical properties, among other property enhancements.


