Anionic Surfactant Composition for Semiconductor Surface Cleaning
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Solution Overview
Problem
Existing surface treatment compositions for semiconductor substrates, particularly those with silicon nitride, silicon oxide, or polysilicon, fail to sufficiently remove residues due to inadequate wettability and adsorption, leading to reduced electrical properties and device reliability.
Innovation Solution
A composition with an anionic surfactant having a molecular weight of 1,000 or less, a pH of less than 7, and a hydrophilic to hydrophobic moiety ratio of 0.4 or more is used for surface treatment, enhancing wettability and residue removal by improving the adsorption rate and dynamic surface tension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional cleaning solution (JP 2012-74678 A) is used for surface treatment, then the substrate surface is not corroded, but residues cannot be sufficiently removed
Solution Approach 1:
The patent changes the molecular weight parameter of the anionic surfactant to 1,000 or less (conventional surfactants typically have higher molecular weights), and adjusts the hydrophilic-to-hydrophobic moiety ratio to 0.4 or more. These parameter changes enable the surfactant to effectively remove residues from silicon nitride, silicon oxide, and polysilicon surfaces while maintaining substrate integrity, resolving the contradiction between residue removal efficiency and substrate protection.
2Manufacturing precision
If the molecular weight of the anionic surfactant is reduced to 1,000 or less, then wettability and adsorption rate improve, but the complexity of formulation increases
Solution Approach 1:
The patent specifies precise parameter ranges for the anionic surfactant: molecular weight of 1,000 or less and hydrophilic-to-hydrophobic moiety ratio of 0.4 or more. By defining these specific parameters, the formulation complexity is managed through clear specifications rather than trial-and-error, enabling systematic optimization of wettability and adsorption rate while controlling formulation development.
3Manufacturing precision
If the hydrophilic to hydrophobic moiety ratio is set to 0.4 or more, then residue removal effectiveness increases, but the cost of surfactant selection and characterization increases
Solution Approach 1:
The patent establishes a minimum threshold for the hydrophilic-to-hydrophobic moiety ratio (0.4 or more) as a key design parameter for the anionic surfactant. This parameter specification guides surfactant selection and formulation development, enabling systematic optimization of residue removal effectiveness while providing a clear criterion for surfactant characterization and evaluation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively removes residues from silicon nitride, silicon oxide, and polysilicon surfaces, improving electrical properties and device reliability by ensuring thorough cleaning and reducing contamination.
Implementation Method 1
a composition for surface treatment including an anionic surfactant having a molecular weight of 1,000 or less and water
Implementation Method 2
a ratio of a molecular weight of a hydrophilic moiety to a molecular weight of a hydrophobic moiety (the molecular weight of the hydrophilic moiety/the molecular weight of the hydrophobic moiety) of the anionic surfactant is 0.4 or more
Data Source
AI summary
The purpose of the present invention is to provide means for sufficiently removing residues on a surface of an object which has been polished including silicon nitride, silicon oxide, or polysilicon.Provided is a composition for surface treatment including an anionic surfactant having a molecular weight of 1,000 or less and water, the composition having a pH of less than 7, wherein a ratio of a molecular weight of a hydrophilic moiety to a molecular weight of a hydrophobic moiety (the molecular weight of the hydrophilic moiety/the molecular weight of the hydrophobic moiety) of the anionic surfactant is 0.4 or more (in which the hydrophobic moiety is a hydrocarbon group having 4 or more carbon atoms and the hydrophilic moiety is a part excluding the hydrophobic moiety and a counterion), and the composition for surface treatment is used for surface treatment of an object which has been polished including at least one selected from the group consisting of silicon nitride, silicon oxide, and polysilicon.