Anisotropic Conductive Block Assembly for Precise Circuit Alignment
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Solution Overview
Problem
Existing electronic devices face challenges in accurately positioning the connection joint between the connector and conductive circuit during manufacturing, leading to potential damage and manufacturing complexity.
Innovation Solution
The use of an anisotropic conductive block with an anisotropic conductive layer and insulating layers, which acts as a connector joint, allows for easier alignment and connection of conductive circuit lines with external components, protected by a plastic layer for waterproof and aesthetic purposes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a connection joint is provided on the electronic flexible printed circuit board to connect to external devices via a circuit line, then electrical connection capability is improved, but positioning accuracy between the connector joint and conductive circuit deteriorates
Solution Approach 1:
The patent introduces a connector joint as an intermediary component between the electronic flexible printed circuit board and external devices. This connector joint includes a positioning structure that mediates the connection process, enabling electrical connection while solving the positioning accuracy problem through its design that allows for easier alignment during manufacturing.
2Ease of manufacture
If traditional connection methods are used, then electrical connection is achieved, but manufacturing complexity increases due to positioning difficulties
Solution Approach 1:
The connector joint is designed with a positioning structure that performs preliminary alignment before the actual connection is made. This preliminary positioning action simplifies the manufacturing process by ensuring correct alignment is achieved before final assembly, reducing the complexity of the overall manufacturing process.
3Reliability
If the electronic device is protected by a plastic layer, then waterproof and dustproof properties are improved, but access to connection points becomes more difficult
Solution Approach 1:
The connector joint is designed with a nested structure where the positioning structure is integrated within the overall connector assembly. This nesting allows the connector to maintain its protective function while providing accessible connection points, as the positioning features are built into the connector itself rather than requiring separate external alignment mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a manufacturing process that reduces damage to internal components, ensures accurate positioning, and simplifies the manufacturing process while maintaining waterproof and dustproof properties.
Implementation Method 1
The anisotropic conductive layer has a first conductive surface, a second conductive surface, and a side surface. The first conductive surface is opposite to the second conductive surface. The side surface is connected between the first conductive surface and the second conductive surface and surrounds the first conductive surface and the second conductive surface.
Data Source
AI summary
An electronic device includes a substrate, conductive circuit lines, an anisotropic conductive block, and a plastic layer. The substrate has an arrangement surface having a mounting area and a coverage area, and the coverage area surrounds the mounting area. The conductive circuit lines are arranged in the coverage area. Each of the conductive circuit lines partially passes through the mounting area. The anisotropic conductive block includes an anisotropic conductive layer. The anisotropic conductive layer has a first conductive surface, a second conductive surface, and a side surface. The first conductive surface is opposite to the second conductive surface. The side surface is connected between the first conductive surface and the second conductive surface and surrounds the first conductive surface and the second conductive surface. The anisotropic conductive block covers the mounting area through the first conductive surface. The plastic layer surrounds the side surface and covers the coverage area.