Anisotropic Conductive Adhesive Regular Particle Arrangement
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Solution Overview
Problem
In the context of reduced electrode terminal heights and finer pitches in liquid crystal displays and other electronic devices, existing anisotropic conductive films face increased inter-terminal short circuit rates due to high-density conductive particle filling, which compromises electrical conduction and connectivity.
Innovation Solution
The use of an anisotropic conductive adhesive agent with conductive particles that are regularly arranged and have a diameter of ½ or less than the height of the connecting electrodes, preventing agglomeration and maintaining distance between particles, even in reduced cross-sectional areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive particles are filled at high density to ensure electrical conduction in narrowed intervals, then electrical conduction is improved, but inter-terminal short circuit occurrence increases
Solution Approach 1:
The patent changes the particle diameter parameter of conductive particles to be 1/2 or less of the electrode terminal height, and regularly arranges particles at controlled intervals. This parameter optimization ensures sufficient electrical conduction while preventing particle agglomeration that causes short circuits between reduced-height electrode terminals.
Solution Approach 2:
The patent applies different spatial distributions of conductive particles: regular arrangement with controlled intervals in regions where electrode terminals are closely spaced, and appropriate density in regions with larger spacing. This localized quality adjustment ensures reliable conduction while preventing short circuits in different areas.
2Length of moving object
If electrode terminal height is reduced for device thinning, then device height is reduced, but inter-terminal short circuit risk increases due to reduced spacing
Solution Approach 1:
The patent optimizes the particle diameter parameter to be 1/2 or less of the reduced electrode terminal height, and controls particle arrangement intervals. This allows the use of thinner electrode terminals for device reduction while maintaining safe spacing between conductive particles to prevent short circuits.
Solution Approach 2:
The patent pre-arranges conductive particles in a regular pattern with controlled intervals before bonding, ensuring that even with reduced electrode terminal height, particles maintain adequate spacing to prevent short circuits while ensuring sufficient contact for conduction.
3Reliability
If conductive particles are regularly arranged with controlled intervals, then inter-terminal short circuit is prevented, but manufacturing complexity increases
Solution Approach 1:
The patent defines specific parameter ranges (particle diameter ≤ 1/2 of electrode terminal height, controlled intervals between particles) that can be achieved through conventional manufacturing processes. This regular arrangement with defined parameters prevents short circuits while maintaining manufacturability through standard techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively prevents inter-terminal short circuits while ensuring reliable electrical conduction between electronic components and circuit substrates, even with reduced electrode terminal heights and finer pitches.
Implementation Method 1
the anisotropic conductive adhesive agent has conductive particles that are regularly arranged; and wherein the conductive particles have a particle diameter that is 1/2 or less than a height of a connecting electrode
Implementation Method 2
electrical conduction between the conductors is achieved by the conductive particles
Data Source
AI summary
Ensure conduction between an electronic component and a circuit substrate having reduced pitches in wiring of the circuit substrate or electrodes of the electronic component and prevent short circuits between electrode terminals of the electronic component. A connection body including an electronic component connected to a circuit substrate via an anisotropic conductive adhesive agent containing conductive particles; wherein the conductive particles are regularly arranged; and wherein the conductive particles have a particle diameter that is ½ or less than a height of a connecting electrode of the electronic component.