Anisotropic Fiber Composite Base Plate for Power Electronics Thermal Management
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Solution Overview
Problem
Current fiber-reinforced metal matrix composites with isotropic fiber distribution fail to effectively distribute and remove heat from high power density areas, leading to thermomechanical stresses and reduced reliability in power electronics and microelectronics.
Innovation Solution
A composite material with anisotropically distributed fibers, such as SiC, highly graphitized carbon, or diamond, oriented predominantly horizontally in upper levels and vertically in lower levels within a high thermal conductivity matrix, allowing for effective heat distribution and directed removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If isotropic fiber distribution is used in composite materials, then manufacturing simplicity is maintained, but heat distribution effectiveness from localized hot spots is insufficient
Solution Approach 1:
The patent applies local quality by creating different fiber orientation patterns in different regions of the composite material. Specifically, the upper layers contain fibers oriented predominantly in the x-direction while lower layers contain fibers oriented predominantly in the y-direction, allowing each region to address specific heat flow patterns from hot spots located at different positions on the component backside.
Solution Approach 2:
The patent employs asymmetry by deliberately creating an anisotropic fiber distribution that is not uniform throughout the material. The asymmetric arrangement of fiber layers with different orientations enables the material to handle heat flow from multiple directions more effectively than a symmetric isotropic distribution would allow.
2Productivity
If high dissipated power density is achieved through increased integration, then functionality and performance improve, but thermomechanical loading and reliability reduction increase
Solution Approach 1:
The patent applies segmentation by dividing the fiber reinforcement into multiple layers with different orientations. This segmented approach allows each layer to specifically address heat flow patterns in particular directions, thereby more effectively managing the thermal loads generated by high integration density without compromising the mechanical reliability of the connection setup.
3Temperature
If active cooling methods are used to remove high dissipated power, then heat removal effectiveness improves, but system complexity and effort increase
Solution Approach 1:
The patent implements self-service by designing the composite material itself to perform the heat distribution function that would otherwise require active cooling systems. The anisotropic fiber distribution passively redirects heat flow from localized hot spots across the component backside, eliminating or reducing the need for complex active cooling mechanisms while maintaining effective temperature management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces thermomechanical loading, increases reliability, and enables higher dissipated power densities by efficiently distributing heat over a larger area and removing it to a cooling device, thereby enhancing the service life and integration density of components.
Implementation Method 1
fibers having an anisotropic, directionally optimized distribution in the matrix material, by which heat occurring in a locally confined area can be effectively distributed and dissipated
Implementation Method 2
The fibers are arranged in the matrix material in various fiber levels, the fibers in the upper fiber levels being oriented predominantly horizontally in relation to a reference area and the fibers in the lower fiber levels being oriented predominantly vertically in relation to the reference area
Implementation Method 3
The material of the fibers includes SiC, highly graphitized carbon or diamond... Thermal conductivities of up to 910 W/m·K were achieved
Data Source
AI summary
A composite material and a base plate made of this composite material for mounting electrical components and for connecting these components to a cooling device is disclosed. In one embodiment, the composite material includes a matrix material and fibers embedded therein. The fibers have in this case an anisotropic, directionally optimized distribution in the matrix material, so that heat occurring in a locally confined area can be effectively distributed and dissipated. The material of the fibers includes SiC, highly graphitized carbon or diamond. The fibers are arranged in the matrix material in various fiber levels, the fibers in the upper fiber levels being oriented predominantly horizontally in relation to a reference area and the fibers in the lower fiber levels being oriented predominantly vertically in relation to the reference area.