Anisotropic Conductive Bonding for Large-Area Semiconductor LED Displays
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Contact failure occurs between semiconductor light emitting devices and wiring electrodes when using an anisotropic conductive layer, particularly as the area of the wiring substrate increases, leading to non-uniform pressure distribution and incomplete electrical connections.
Innovation Solution
A structure involving a substrate with wiring electrodes, semiconductor light emitting devices, anisotropic conductive layers, and light transmitting layers is employed, where the anisotropic conductive layer includes a first region on the wiring electrode and a second region between electrodes, with the light transmitting layer surrounding the semiconductor devices and protruding through the wiring electrodes, and a manufacturing method involving resin coating, curing, and light transmitting resin injection is used to maintain consistent pressure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an anisotropic conductive layer is used to connect semiconductor light emitting devices to wiring electrodes, then electrical connection is achieved through thermal compression, but contact failure occurs when the area of the wiring substrate is increased
Solution Approach 1:
The anisotropic conductive layer is divided into two regions with different thicknesses: a first region formed on the wiring electrode and a second region formed between the wiring electrodes. The second region has a smaller average thickness than the first region, creating local quality variation that prevents conductive particle flow to non-contact areas while maintaining reliable electrical connection at the contact points, even when the wiring substrate area is increased
Solution Approach 2:
The anisotropic conductive layer is segmented into functionally different regions: the first region on the wiring electrode provides the primary electrical connection interface, while the second region between wiring electrodes acts as a barrier to prevent conductive particle migration. This segmentation allows the system to maintain connection reliability across larger substrate areas by localizing the conductive function where needed and blocking it where not needed
2Quantity of substance
If the area of the wiring substrate is increased, then more semiconductor light emitting devices can be connected, but non-uniform pressure distribution causes incomplete electrical connections
Solution Approach 1:
By creating a second region with smaller average thickness between the wiring electrodes, the anisotropic conductive layer exhibits different compression characteristics in different locations. This local quality variation ensures that during thermal compression, the conductive particles are confined to the first region where electrical connection is needed, preventing non-uniform pressure distribution from causing contact failure across larger substrates with more devices
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This structure minimizes conductive particle flow and prevents separation between semiconductor light emitting devices and wiring electrodes, ensuring uniform pressure application and preventing contact failure, even with wider wiring substrates.
Implementation Method 1
an anisotropic conductive layer made of a mixture of materials and a light transmitting layer formed between the semiconductor light emitting devices, the anisotropic conductive layer is also formed between the wiring electrodes
Implementation Method 2
The use of an anisotropic conductive layer has the advantage of being able to electrically connect the semiconductor light emitting device and the wiring electrode only by thermal compression
Data Source
AI summary
The present invention includes a substrate, a wiring electrode disposed on the substrate, a plurality of semiconductor light emitting devices electrically connected to the wiring electrode, and an anisotropic conduction comprising a mixture of conductive particles and an insulating material disposed between the semiconductor light emitting devices and a light transmitting layer formed between the semiconductor light emitting devices. The anisotropic conductive layer is also formed between the wiring electrodes, and the light transmitting layer is formed on the anisotropic conductive layer formed between the wiring electrodes.