Anisotropic Pattern Prevents Base Material Scattering in Flexible OLED Substrate Removal
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Solution Overview
Problem
The existing methods for manufacturing flexible organic light emitting display devices face issues with scattering of base materials and reduced reliability during the removal of glass substrates, leading to damage and foreign substances in the device.
Innovation Solution
The use of an anisotropic pattern with controlled spreadability, combined with an anisotropic conductive film and adhesive layer, prevents the scattering of base materials by blocking the spread of the adhesive layer and ensuring proper bonding and removal of glass substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If glass substrates are removed after forming base materials on both substrates, then slimming and flexibility are achieved, but base materials scatter and reliability decreases
Solution Approach 1:
The adhesive layer is applied in advance to specific regions where glass substrate removal is expected, creating a protective structure before the removal process occurs. This preliminary bonding prevents base material scattering when the glass substrate is later removed through laser irradiation.
Solution Approach 2:
The adhesive layer acts as an intermediary substance between the base material and the glass substrate. It provides controlled adhesion that allows the glass substrate to be removed while keeping the base material intact, thus preventing scattering and maintaining reliability during the thinning process.
2Area of stationary object
If adhesive layer is applied with large spreading degree, then bonding area increases, but base material scatters during glass substrate removal
Solution Approach 1:
The adhesive layer is applied with different spreading degrees in different regions. In regions where glass substrate removal is planned, the adhesive has controlled spreading to prevent base material scattering. In other regions, normal spreading is maintained for proper bonding, thus achieving local optimization of both bonding area and positioning precision.
3Area of stationary object
If adhesive layer area exceeds base material area, then bonding coverage increases, but glass substrate removal becomes difficult
Solution Approach 1:
The adhesive layer is designed with spatially varying properties: in regions adjacent to the glass substrate, the adhesive area is controlled to match the substrate boundaries, facilitating complete removal. In other regions, the adhesive can spread more to ensure adequate bonding coverage, thus resolving the conflict between bonding coverage and removal ease.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively prevents the scattering of base materials and ensures reliable bonding and removal of glass substrates, enhancing the overall reliability and flexibility of the organic light emitting display device.
Implementation Method 1
bonding the thin film transistor array and light emitting diode array 12 and the touch electrode array 22 by an adhesive layer 30 interposed therebetween
Implementation Method 2
through laser irradiation, the second glass substrate 20 is removed and then the first glass substrate 10 is removed
Data Source
AI summary
Disclosed is an organic light emitting display device provided in view of scattering of base materials and lowering of reliability during cutting, when the base materials are formed on both glass substrates and then the glass substrates are removed so as to achieve slimming and flexibility of the device. The organic light emitting display device includes an anisotropic pattern in a dead area of a base material, wherein the dead area of the base material has regions that protrude from an active area by differing amounts.