Anisotropic PCB Core Substrate for Alignment-Free Vertical Interconnects
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Solution Overview
Problem
Existing vertical electrical connection products in electronic devices and integrated circuits face challenges such as high costs, complexity in manufacturing, and alignment issues due to the use of nonconductive base materials and precise fabrication techniques, which are costly and time-consuming.
Innovation Solution
A universal substrate that is conductive in one axis and nonconductive in an orthogonal axis, allowing for randomized electrical connections and flexible non-linear configurations, enabling efficient interconnection of devices without the need for precise alignment or complex fabrication.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through substrate vias are used for vertical electrical connections, then electrical connectivity between devices is achieved, but manufacturing cost and complexity increase due to precise fabrication requirements
Solution Approach 1:
The substrate is divided into multiple conductive layers separated by nonconductive layers, allowing electrical connections to be established through stacked conductive pathways rather than requiring precise through-substrate vias. This segmentation simplifies manufacturing while maintaining electrical connectivity.
Solution Approach 2:
The patent transitions from vertical through-substrate via connections to a combination of lateral conductive pathways on multiple stacked layers. This dimensional shift allows electrical connections to be made through a series of parallel conductive paths across layers rather than requiring precise vertical drilling and plating through the entire substrate thickness.
2Reliability
If through substrate vias are fabricated with precise machinery, then electrical connections are established, but production time and cost increase
Solution Approach 1:
Conductive pathways are formed on individual layers before stacking subsequent layers. This preliminary formation of conductive paths on each layer allows for simpler, faster manufacturing compared to requiring precise through-substrate via fabrication after all layers are assembled. The conductive pathways are prepared in advance on each layer, enabling more rapid production.
3Reliability
If solder balls are used for device connections, then electrical connections are made, but alignment precision requirements increase manufacturing complexity
Solution Approach 1:
The stacked conductive layers and nonconductive layers serve as an intermediary structure that facilitates electrical connections between devices. Rather than requiring direct alignment of solder balls with precise positioning, the layered structure provides built-in alignment references and conductive pathways that simplify the connection process and reduce alignment precision requirements.
4Reliability
If plated metal pillars are used with varying heights, then electrical connections are established, but uniform plating thickness becomes difficult to achieve
Solution Approach 1:
The substrate structure is segmented into multiple discrete conductive layers with controlled thicknesses. Each conductive layer can be independently controlled during fabrication, allowing for uniform plating thickness on each layer while accommodating varying overall heights through the stacking sequence. This segmentation enables precise control of plating uniformity on each individual layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The universal substrate facilitates cost-effective and efficient electrical and thermal connectivity between devices with flexible non-linear configurations, reducing manufacturing complexity and alignment issues, and accommodating devices with irregular shapes.
Implementation Method 1
The anisotropic conductive substrate conducts electricity in a vertical axis while blocking conduction in a horizontal axis
Implementation Method 2
the universal substrate is also a compliant device that may flex to define one or more non-linear or curvilinear sections
Data Source
AI summary
A universal substrate for a printed circuit board (PCB) package. The universal substrate includes a first end and a second end opposite to the first end, a plurality of conductors located between the first end and the second end, and a nonconductive matrix. The plurality of conductors has a first connection end, a second connection end opposite to the first connection end, and a plurality of conductive pathways defined between the first connection end and the second connection end. The nonconductive matrix surrounds the plurality of conductors and configured to isolate each conductor of the plurality of conductors from one another along an axis that is perpendicular to the plurality of pathways. The universal substrate also includes at least one non-linear section defined between the first connection end and the second connection end.