Anisotropic Heat Dissipation Plate Layout for Corner Heat Spreading
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Solution Overview
Problem
Existing semiconductor modules with heat dissipation plates made of materials with anisotropic thermal conductivity, such as graphite, face inefficiencies in heat transfer to the corners of the plate, leading to underutilization of the heat dissipation area and reduced thermal performance.
Innovation Solution
The semiconductor module incorporates a heat dissipation plate with a first heat dissipation portion facing the semiconductor element and a second heat dissipation portion connected in a direction parallel to the first virtual plane, perpendicular to the thickness direction, allowing heat to spread and dissipate across the entire plate surface, enhancing thermal conductivity and utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat dissipation plate made of material with anisotropic thermal conductivity (e.g., graphite) is used, then thermal conductivity in certain directions is improved, but heat transfer to the corners of the plate deteriorates, leading to underutilization of the heat dissipation area
Solution Approach 1:
The heat dissipation plate is divided into multiple heat dissipation portions (first heat dissipation portion and second heat dissipation portion) with different orientations. The first heat dissipation portion has its high thermal conductivity direction aligned with the thickness direction to efficiently conduct heat from the semiconductor element, while the second heat dissipation portion is oriented at an angle (e.g., 45 degrees) to direct heat toward the corners of the plate. This segmentation allows each portion to specialize in heat transfer to different regions, resolving the contradiction between maintaining high thermal conductivity and achieving uniform heat distribution across the entire plate area.
Solution Approach 2:
Different regions of the heat dissipation plate are assigned different local qualities in terms of thermal conductivity orientation. The first heat dissipation portion beneath the semiconductor element has high thermal conductivity in the thickness direction for immediate heat absorption, while the second heat dissipation portion extending toward the corners has its high thermal conductivity direction angled to facilitate corner heat transfer. This local differentiation of thermal properties ensures that each region optimally performs its specific heat dissipation function, maximizing overall area utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively spreads heat across the entire heat dissipation plate, improving thermal performance by increasing the functional heat dissipation area and reducing temperature gradients, thus enhancing the module's ability to dissipate heat efficiently.
Implementation Method 1
a first heat dissipation portion and a second heat dissipation portion formed of a material having anisotropic thermal conductivity
Implementation Method 2
The first heat dissipation portion has higher thermal conductivity in a planar direction of a first virtual plane parallel to the thickness direction than in a direction perpendicular to the planar direction
Data Source
AI summary
A heat dissipation plate of a semiconductor module includes a first heat dissipation portion and a second heat dissipation portion formed of a material having anisotropic thermal conductivity. The first heat dissipation portion includes a position facing a semiconductor element in a thickness direction of the heat dissipation plate, and has higher thermal conductivity in a planar direction of a first virtual plane parallel to the thickness direction than in a direction perpendicular to the planar direction of the first virtual plane. The second heat dissipation portion is connected to the first heat dissipation portion in a direction parallel to the planar direction of the first virtual plane and perpendicular to the thickness direction, and has higher thermal conductivity in a planar direction of a second virtual plane perpendicular to the thickness direction than in a direction perpendicular to the planar direction of the second virtual plane.