Anisotropic Thermal Conductivity Substrate for Heat Dissipation
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Solution Overview
Problem
Existing electronic element mounting substrates face challenges in efficiently dissipating heat generated by electronic elements, leading to potential expansion and positional deviation issues, which can affect the reliability and performance of electronic devices, particularly in high-power and optical applications.
Innovation Solution
The electronic element mounting substrate is designed with a first substrate made of a thermally conductive material like aluminum nitride and a second substrate made of carbon material, where the thermal conductivity in directions perpendicular to the longitudinal direction is greater than in the longitudinal direction, facilitating heat dissipation and reducing expansion-related distortions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation is improved by using thermally conductive materials, then temperature control is enhanced, but device complexity increases due to the need for anisotropic thermal conductivity structure
Solution Approach 1:
The patent employs a composite substrate structure consisting of a first substrate with isotropic thermal conductivity and a second substrate with anisotropic thermal conductivity (higher in the thickness direction than in the planar direction). This composite configuration enables enhanced heat dissipation in the thickness direction while maintaining structural integrity, resolving the contradiction between improved temperature control and device complexity by using naturally anisotropic materials rather than complex engineered structures
Solution Approach 2:
The patent applies different thermal conductivity characteristics to different regions of the substrate structure. The second substrate is specifically designed with higher thermal conductivity in the thickness direction to target heat dissipation from the light-emitting region, while the first substrate provides uniform thermal support. This localized optimization achieves effective heat management without requiring the entire device structure to be complex
2Stability of the object's composition
If thermal conductivity in the thickness direction is increased to reduce expansion, then positional stability is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent changes the thermal conductivity parameter of the substrate materials, specifically selecting a second substrate with anisotropic thermal conductivity where the thermal conductivity in the thickness direction is higher than in the planar direction. This parameter change enables thermal expansion control in the thickness direction to improve positional stability, while the inherent material properties reduce the need for ultra-precise manufacturing tolerances
3Reliability
If a multi-layer substrate structure is used to control thermal expansion, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent uses a composite of two substrate types with different thermal conductivity characteristics. The first substrate provides uniform thermal support, while the second substrate with anisotropic thermal conductivity (higher in thickness direction) specifically addresses thermal expansion issues. This material-based solution achieves improved reliability through natural material properties rather than complex structural designs, thereby limiting the increase in device complexity
Solution Approach 2:
The patent converts the typically problematic thermal expansion effect into a beneficial control mechanism. By using a second substrate with higher thermal conductivity in the thickness direction, the thermal expansion that would normally cause positional deviation is instead controlled and directed, transforming a harmful effect into a means of achieving positional stability and improved reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances long-term reliability by effectively dissipating heat away from the electronic elements, reducing expansion and positional deviations, and ensuring stable operation and accurate light emission in electronic devices.
Implementation Method 1
a thermal conduction of the mounting portion in a direction perpendicular to the longitudinal direction is greater than a thermal conduction of the mounting portion in the longitudinal direction
Implementation Method 2
effectively dissipating heat away from the electronic elements, reducing expansion and positional deviations
Data Source
AI summary
An electronic element mounting substrate includes a first substrate including a first main surface and a mounting portion in a rectangular shape for mounting an electronic element, positioned on the first main surface and one end portion of the mounting portion in a longitudinal direction being positioned at an outer edge portion of the first main surface and a second substrate positioned on a second main surface opposite to the first main surface, formed of a carbon material, and including a third main surface facing the second main surface and a fourth main surface opposite to the third main surface. A thermal conduction of the mounting portion in a direction perpendicular to in a longitudinal direction is greater than a thermal conduction of the mounting portion in the longitudinal direction, in the third main surface or the fourth main surface, in plan view.