Anisotropic Substrate Resistance Temperature Sensor

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Solution Overview

Problem

Existing resistance temperature sensors require complex wiring and increased space due to separate temperature sensors, making them unsuitable for miniaturization and self-monitoring in process automation, where they should not disturb the actual process, and are costly to manufacture.

Innovation Solution

A resistance temperature sensor with two temperature sensor elements on a substrate with anisotropic thermal expansion, where the measuring paths differ in projection on the expansion directions, allowing for self-calibration and monitoring, and enabling continued temperature determination if one sensor fails.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If separate temperature sensors are used, then temperature measurement capability is improved, but device complexity and space requirements increase

Engineering Contradiction:
Improvetemperature measurement capabilityVSAvoidwiring complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent combines two temperature sensor elements into a single integrated sensor head, where both sensor elements are thermally coupled to the same measuring medium and share common wiring connections. This merging approach maintains the ability to perform temperature measurement while reducing wiring complexity and space requirements compared to using completely separate sensors.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The sensor elements serve multiple functions: they can be used individually for temperature measurement, together for self-monitoring through drift comparison, and for self-calibration purposes. This multi-functionality allows the system to achieve enhanced measurement capability without proportionally increasing device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Measurement precision

If separate temperature sensors are used, then temperature measurement capability is improved, but space requirements increase

Engineering Contradiction:
Improvetemperature measurement capabilityVSAvoidspace requirement
Core Design Contradiction:
Measurement precisionVSArea of stationary object

Solution Approach 1:

The patent implements a nested structure where two sensor elements are integrated within a single sensor head assembly. The elements are positioned in parallel planes and thermally coupled to the same measuring medium, allowing them to occupy shared space rather than requiring separate mounting locations. This nesting approach maintains measurement capability while significantly reducing the overall space footprint.

Inventive Principle:
Principle #7Nested doll (Nesting)

3Reliability

If drift monitoring is implemented, then sensor reliability is improved, but device complexity increases

Engineering Contradiction:
Improvedrift monitoring capabilityVSAvoidmonitoring system complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent implements a self-monitoring system where the sensor elements monitor each other's performance. By comparing the resistance values of the two elements, the system can detect drift or failures automatically without requiring external monitoring equipment. This self-service approach improves reliability while avoiding the complexity of separate monitoring systems.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent incorporates a feedback mechanism where the resistance values of both sensor elements are continuously compared. When drift or failure is detected in one element, the system can identify the issue and switch to using the other element for temperature measurement. This feedback loop enhances reliability while maintaining relatively simple system architecture.

Inventive Principle:
Principle #23Feedback

4Area of stationary object

If miniaturization is pursued, then space requirements are reduced, but manufacturing complexity increases

Engineering Contradiction:
Improvesensor sizeVSAvoidmanufacturing complexity
Core Design Contradiction:
Area of stationary objectVSEase of manufacture

Solution Approach 1:

The patent divides the sensor into distinct elements arranged in parallel planes, with each element having its own measuring path. This segmentation allows for modular manufacturing where each element can be fabricated separately using thin film technology and then integrated into the final sensor assembly. The anisotropic substrate with different expansion coefficients in different directions enables this segmented structure while maintaining compact dimensions.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a compact, self-calibrating temperature measurement system that reduces manufacturing costs and minimizes space requirements while ensuring continuous temperature measurement and fault diagnosis.

Implementation Method 1

the substrate has an anisotropic thermal expansion with at least two mutually differing expansion directions

Methodology Applied
Scientific EffectAnisotropic thermal expansion: Thermal Expansion

Data Source

PatentUS8777484B2Resistance temperature sensor
Publication Date: 2014.07.15 ENDRESS & HAUSER GMBH & CO KG
  • US8777484B2 patent drawing
  • US8777484B2 patent drawing
  • US8777484B2 patent drawing

AI summary

A resistance temperature sensor with a first temperature sensor element and a second temperature sensor element, wherein the first temperature sensor element comprises a first measuring path and the second temperature sensor element a second measuring path, wherein the first and the second measuring paths extend on a substrate, wherein the substrate has an anisotropic thermal expansion with at least two mutually differing expansion directions (a, c), and wherein a projection of the first measuring path on the expansion directions (a) differs from a projection of the second measuring path on the expansion directions (c).