Anisotropic Substrate Support for Even Heating and Electrical Isolation
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Solution Overview
Problem
Monolithic ceramic substrate supports in substrate processing systems face issues with thermal energy spreading and reproducibility due to insufficient thickness, which leads to hot spots and mechanical failure, and electrical energy losses from shorting between electrodes and heating elements.
Innovation Solution
A substrate support with a monolithic anisotropic body comprising multiple layers of different materials, including a first layer with RF and clamping electrodes, a second layer with a heating element, and an intermediate layer with varying thermal and electrical conductivity, strategically positioned to improve thermal energy spreading and prevent electrical dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the ceramic body thickness is increased to spread thermal energy more evenly, then thermal energy spreading is improved, but material cost and manufacturing complexity increase
Solution Approach 1:
The patent applies local quality by creating layers with different thermal conductivities at specific locations within the ceramic body. The intermediate layer with higher thermal conductivity is positioned between the heating element and the substrate to locally enhance heat distribution where needed, rather than uniformly increasing the entire ceramic body thickness.
Solution Approach 2:
The patent uses composite materials by combining ceramic layers with different thermal conductivity properties. The multi-layer structure includes materials with varying thermal conductivities to optimize heat spreading in specific regions while maintaining overall structural integrity and reducing total material usage.
2Temperature
If the ceramic body thickness is increased to spread thermal energy more evenly, then thermal energy spreading is improved, but manufacturing precision deteriorates due to component placement shifting
Solution Approach 1:
The patent segments the ceramic body into multiple thin layers rather than using a single thick layer. This segmentation allows each layer to be manufactured and assembled with better precision control, reducing the accumulation of placement errors that occur in thicker monolithic structures.
Solution Approach 2:
The patent transitions from a monolithic three-dimensional structure to a multi-layered planar structure. By distributing the thermal management function across multiple thin layers in the vertical dimension, the patent achieves better manufacturing precision while maintaining effective thermal spreading.
3Quantity of substance
If the ceramic body thickness is reduced to decrease material usage, then material cost is reduced, but thermal energy spreading deteriorates causing hot spots
Solution Approach 1:
The patent applies local quality by strategically positioning an intermediate layer with enhanced thermal conductivity between the heating element and the substrate. This localized enhancement provides sufficient thermal spreading capability in the critical heat generation region without requiring increased overall thickness.
Solution Approach 2:
The patent employs composite materials with different thermal conductivity properties in a multi-layer configuration. The combination of standard ceramic layers with an intermediate high-conductivity layer creates a composite structure that achieves superior thermal spreading in a thin profile.
4Quantity of substance
If the ceramic body thickness is reduced to decrease material usage, then material cost is reduced, but electrical energy losses from shorting increase
Solution Approach 1:
The patent segments the ceramic structure into multiple layers with an intermediate layer positioned between the heating element and other electrodes. This segmentation creates electrical isolation that prevents shorting paths while maintaining a compact overall thickness.
Solution Approach 2:
The intermediate layer acts as an electrical intermediary or barrier between the heating element and other conductive components. This intermediary layer prevents direct electrical contact and energy loss through shorting while allowing thermal energy to pass through.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances thermal energy spreading and prevents electrical losses, allowing for more even heating and reduced power consumption, while maintaining a thinner ceramic body to minimize material usage and manufacturing costs.
Implementation Method 1
The first intermediate layer is formed of a different material than the first layer and the second layer, such that at least one of: a thermal energy conductivity of the first intermediate layer is different than a thermal energy conductivity of at least one of the first material or the second material
Implementation Method 2
an electrical energy conductivity of the first intermediate layer is different than an electrical conductivity of at least one of the first material or the second material
Data Source
AI summary
A substrate support includes a monolithic anisotropic body, which includes first, second and intermediate layers. The first layer is formed of a first material and disposed therein are RF and clamping electrodes. The second layer is formed of the first material or a second material and disposed therein is a heating element. The intermediate layer is formed of a different material than the first and second layers, such that at least one of: a thermal energy conductivity of the intermediate layer is different than a thermal energy conductivity of at least one of the first or second materials; or an electrical energy conductivity of the intermediate layer is different than an electrical conductivity of at least one of the first or second materials. Either the intermediate layer is disposed between the first and second layers or the second layer is disposed between the first and intermediate layers.