Anisotropic Thermoelectric Material via Slice Stacking

The patent replaces complex chemical vapor deposition or molecular beam epitaxy processes with a simpler mechanical pressing process. Slices are prepared by conventional methods and then stacked and pressed mechanically to form the thermoelectric module, eliminating the need for lengthy and expensive vapor deposition processes while achieving comparable or superior thermoelectric performance.

The patent divides the thermoelectric material into separate slices that are prepared independently and then stacked. This segmentation allows each slice to be manufactured using simple, fast processes, and the final assembly is achieved through mechanical stacking and pressing rather than complex continuous deposition, significantly reducing production time.

The patent creates a composite structure by stacking multiple slices of different thermoelectric materials (n-type and p-type) with specific compositions. This composite approach allows optimization of each layer's properties while achieving superior overall thermoelectric performance through the stacked configuration, overcoming the limitations of conventional homogeneous powder sintering.

The patent applies local quality by preparing slices with specific compositions and properties for different positions in the stack. Each slice can be optimized for its specific function (e.g., different leg lengths, different material compositions), allowing tailored thermoelectric performance in different regions of the module while maintaining simple manufacturing processes.