Annealed Yttria Coating for Plasma Chamber Etch Resistance
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Solution Overview
Problem
Current plasma processing chamber components, particularly those made of ceramic alumina, are not sufficiently plasma etch-resistant, leading to degradation and contamination issues.
Innovation Solution
A component for a plasma processing chamber is coated with a yttria coating deposited via aerosol deposition and subsequently annealed, ensuring the coating is at least 95% pure yttria by weight.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If ceramic alumina is used for plasma processing chamber components, then the components have basic plasma resistance, but they are not sufficiently plasma etch-resistant and degrade over time
Solution Approach 1:
The patent applies composite materials by coating alumina or silica components with a yttria-based coating material. This creates a composite structure where the underlying ceramic component provides structural integrity while the yttria coating layer provides enhanced plasma etch resistance. The coating material comprises yttria and optionally other materials, forming a multi-material composite that combines the advantages of different materials to achieve superior plasma resistance and extended component lifespan.
2Productivity
If components are exposed to plasma, then plasma processing occurs, but components degrade and become a source of contaminants
Solution Approach 1:
The patent applies preliminary anti-action by pre-coating plasma-exposed components with a yttria-based coating before they are subjected to plasma processing. This protective coating is applied in advance to prevent plasma-induced degradation and contaminant generation. The coating acts as a barrier that protects the underlying component material from plasma attack, thereby preventing the generation of harmful contaminants while allowing plasma processing to proceed normally.
3Reliability
If coating is applied to enhance plasma resistance, then etch resistance improves, but coating purity and density must be maintained under plasma exposure
Solution Approach 1:
The patent applies parameter changes by carefully controlling the composition parameters of the coating material, specifying that it comprises yttria and optionally other materials with defined weight percentages. The coating is designed with specific compositional parameters that enhance plasma resistance while maintaining stability. By optimizing the material composition parameters and coating application parameters, the patent achieves a coating that maintains high purity and density even after prolonged plasma exposure, preventing degradation and contaminant generation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The yttria coating significantly enhances etch resistance, reducing contamination and erosion, particularly at termination zones, and maintains high purity and density even after exposure to plasma.
Implementation Method 1
an aerosol deposition coating of a yttria powder is deposited on the component body
Implementation Method 2
The aerosol deposition coating is annealed
Implementation Method 3
the aerosol deposition coating is annealed
Data Source
AI summary
A component of a plasma processing chamber is provided. A yttria coating is formed on a surface of a component body, wherein the yttria coating is deposited by aerosol deposition and is annealed, wherein the yttria coating is at least 95% pure yttria by weight.