Annular Cap Heater for Substrate Temperature Uniformity
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Solution Overview
Problem
Conventional batch-type substrate processing apparatuses face challenges in efficiently heating the center portion of substrates, leading to prolonged temperature stabilization times due to inadequate heating of the center region, resulting in non-uniform temperature distribution and increased processing times.
Innovation Solution
A substrate processing apparatus is designed with a thermal insulation unit below the substrate support, a first heating unit surrounding the processing chamber, and a second annular-shaped cap heater between the substrate support and thermal insulation unit, featuring a suspending member and a diameter smaller than the substrate, to enhance heating of the bottom region and improve temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater surrounds the processing chamber to heat substrates, then the overall heating capability is improved, but the center portion of the substrate on the lower portion is difficult to heat and temperature stabilization time is increased
Solution Approach 1:
The heating system is divided into two independent heating units: a first heating unit surrounding the processing chamber for overall heating, and a second heating unit positioned below the substrate support for targeted bottom heating. This segmentation allows each unit to address specific heating needs, with the second unit specifically compensating for the poor heating of the substrate center portion.
Solution Approach 2:
The heating approach transitions from purely lateral heating (first heating unit) to include vertical/bottom heating (second heating unit). By adding heating from the bottom dimension, the substrate center portion receives heat from multiple directions, improving temperature uniformity and reducing stabilization time.
2Temperature
If the heater diameter is made smaller than the substrate, then the center region heating is improved, but the heating area is reduced
Solution Approach 1:
The second heating unit with smaller diameter is strategically positioned to target the center region of the substrate, which is the area with the greatest heating deficiency. This local quality approach concentrates heating power where it is most needed rather than distributing it uniformly across the entire substrate area.
Solution Approach 2:
The heating effects of the first heating unit (lateral heating) and the second heating unit (bottom heating) are merged to achieve comprehensive temperature uniformity. The combination of these two heating sources compensates for the limited heating area of the smaller second unit while maintaining focus on the center region.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces temperature stabilization time, improves surface temperature uniformity, and increases processing efficiency by ensuring uniform heating of the substrate, thereby enhancing the substrate processing apparatus's performance.
Implementation Method 1
a first heating unit disposed around the processing chamber and configured to heat an inside of the processing chamber from a lateral side thereof
Implementation Method 2
a second heating unit disposed between the substrate support and the thermal insulation unit inside the processing chamber
Implementation Method 3
a thermal insulation unit disposed below the substrate support
Data Source
AI summary
The present invention is directed providing a technique capable of reducing a time for stabilizing a temperature in a processing chamber. The technique includes: a substrate support configured to support a substrate; a thermal insulation unit disposed below the substrate support; a processing chamber configured to accommodate the substrate support and where the substrate is processed; a first heating unit disposed around the processing chamber and configured to heat an inside of the processing chamber from a lateral side thereof; and a second heating unit disposed between the substrate support and the thermal insulation unit inside the processing chamber, the second heating unit including a heater having a substantially annular shape and a suspending member extending downward from the heater, wherein a diameter of the heater is smaller than that of the substrate.