Annular Detection Structure for Semiconductor Opening Location

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Solution Overview

Problem

Existing semiconductor manufacturing processes face challenges in accurately detecting and locating openings in semiconductor dies, which affects manufacturing yield and quality.

Innovation Solution

A method and semiconductor device that utilize a detection structure formed in an annular shape within the semiconductor die, generating a clock signal by contacting a probe to the detection structure through a switch, and measuring the period of the clock signal to determine the location of the opening.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional inspection methods are used to detect openings in semiconductor dies, then the inspection process is simple, but the detection precision and location accuracy are insufficient

Engineering Contradiction:
Improvedetection precisionVSAvoiddetection structure complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The detection structure is divided into multiple conduction segments arranged in an annular shape around the peripheral circuit region. Each segment can be independently contacted by the probe, allowing segmented measurement of the clock signal period to determine opening location with high precision without requiring a complex monolithic detector

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A clock signal is introduced as an intermediary to transfer information about the opening location. The probe contacts the detection structure to generate or modify the clock signal, and the period of this signal serves as a mediator that encodes the position of the opening, enabling precise detection without direct mechanical measurement

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If the detection structure is made more complex to improve opening location accuracy, then the detection precision improves, but the device complexity increases

Engineering Contradiction:
Improveopening location accuracyVSAvoiddetection structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The detection structure uses an annular (curved) arrangement of conduction segments around the peripheral circuit region instead of linear segments. This curved geometry provides better spatial distribution for detecting openings at different locations with uniform precision, improving location accuracy while maintaining reasonable structural complexity

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The clock signal operates periodically, and the detection method counts the number of periods or measures the period duration to determine opening location. This periodic measurement approach converts spatial position information into temporal information, achieving high precision detection without requiring overly complex structural arrangements

Inventive Principle:
Principle #19Periodic action

3Productivity

If conventional detection methods are used, then the device complexity is low, but the productivity and manufacturing yield are reduced due to inability to accurately detect openings

Engineering Contradiction:
Improvemanufacturing yieldVSAvoidmeasuring circuit complexity
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The detection structure utilizes existing conduction paths and circuit elements within the semiconductor device itself rather than requiring entirely separate external testing equipment. The clock signal can be generated from existing circuitry, and the detection process leverages the device's own structure, reducing additional complexity while improving detection capability and manufacturing yield

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The detection method replaces potential mechanical or visual inspection methods with electrical measurement of the clock signal period. This substitution provides more precise and automated detection of opening locations, improving manufacturing yield through better defect detection without significantly increasing overall device complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20250035701A1Method of detecting opening of semiconductor device including detection structure and semiconductor device
Publication Date: 2025.01.30 SAMSUNG ELECTRONICS CO LTD
  • US20250035701A1 patent drawing
  • US20250035701A1 patent drawing
  • US20250035701A1 patent drawing

AI summary

A method of detecting an opening of a semiconductor device includes generating a clock signal based on a probe of a measuring circuit contacting, via a switch, an end of a detection structure, measuring a period of the clock signal, counting a number of periods of the clock signal during a reference time interval, and determining, based on the number of periods of the clock signal, a location of the opening of the semiconductor device. The detection structure being formed in a semiconductor die of the semiconductor device in an annular shape.