Annular Dicing Blade for Ceramic Substrate Cutting
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Solution Overview
Problem
The production of high-definition inkjet heads with increased nozzle density faces challenges due to uneven cut surfaces caused by cutting chips generated during the full-cut process of ceramic substrates using dicing blades, leading to variations in channel length and ejection performance, as well as defective adhesion and conduction issues.
Innovation Solution
A dicing blade with an annular abrasive grain layer on both surfaces and a thinner inner-peripheral side portion is used, where the annular blade portion is narrower than the cutting depth, allowing cutting chips to be discharged and preventing further cutting, resulting in parallel and accurate cut surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a dicing blade with full-width abrasive grain layer is used for cutting ceramic substrates, then cutting efficiency is improved, but cutting chips remain between the blade and substrate causing uneven cut surfaces and reduced machining precision
Solution Approach 1:
The abrasive grain layer is segmented into an annular configuration with a narrow width in the radial direction, creating distinct cutting zones that prevent chip accumulation and improve cut surface quality while maintaining cutting efficiency
Solution Approach 2:
The dicing blade features a non-uniform abrasive grain layer distribution with narrow radial width specifically at the cutting periphery, optimizing chip discharge in the critical cutting zone while maintaining structural integrity of the blade
2Strength
If the annular blade portion width is increased to improve structural strength, then blade durability is improved, but chip discharge capability deteriorates and cutting accuracy decreases
Solution Approach 1:
The blade design shifts focus from radial width to axial thickness for strength provision, while the narrow radial annular configuration optimizes chip discharge. The dimensional redistribution allows both strength and precision requirements to be met simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces the influence of cutting chips, ensuring higher accuracy in machining and preventing variations in channel length, adhesion, and conduction issues, thereby improving the manufacturing process for inkjet heads.
Implementation Method 1
the dicing blade (A) has an annular blade portion (91) made of an abrasive grain layer formed over an entire circumference on both surfaces on peripheral edge sides of a disc-shaped base metal (9)
Data Source
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AI summary
A method for producing a head chip and a method for producing an inkjet head which reduce an influence cutting chips when a ceramic substrate is cut or cut off by a dicing blade and enable machining with high accuracy are provided. In a dicing blade A for cutting or cutting off a ceramic substrate 10, an annular blade portion 91 made of an abrasive grain layer over the entire circumference is formed on both surfaces on peripheral edge sides of a disc-shaped base metal 9, and an inner-peripheral side portion 9a is thinner than a peripheral-edge side portion, and a width a of the annular blade portion 91 in a radial direction is smaller than a cutting depth b of the ceramic substrate 10 to be cut or cut off.