Annular Dummy Die Packaging for Dense IC Integration
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving miniaturization, higher speed, greater bandwidth, and lower power consumption in semiconductor devices, necessitating innovative packaging techniques for stacked semiconductor devices.
Innovation Solution
The development of integrated circuit packages that utilize dummy dies with annular structures, where a dummy die is attached to an integrated circuit die, encapsulated, and the interior portion is removed to create an annular structure, allowing for efficient packaging and integration of functional components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If conventional packaging techniques are used for stacked semiconductor devices, then manufacturing simplicity is maintained, but packaging density and physical size optimization are limited
Solution Approach 1:
The dummy die is segmented into a functional annular region and a non-functional interior region. The interior region is removed to create an annular structure that can accommodate additional functional components, thereby increasing packaging density without significantly complicating the overall packaging structure.
Solution Approach 2:
The annular structure of the dummy die is designed to nest additional functional components within its central opening. This nested configuration allows multiple functional elements to be integrated within the footprint of a single dummy die, optimizing packaging density.
2Area of stationary object
If dummy dies are used to maintain packaging uniformity, then structural consistency is achieved, but space utilization is reduced
Solution Approach 1:
The dummy die is divided into a functional annular region that maintains structural uniformity with other dies and a removable interior region. This segmentation allows the annular portion to preserve packaging consistency while the removed interior maximizes space utilization for functional components.
Solution Approach 2:
The dummy die structure transitions from a solid two-dimensional planar structure to a three-dimensional annular structure with a central opening. This dimensional change enables vertical stacking of functional components within the opening, improving space utilization without compromising horizontal packaging uniformity.
3Adaptability or versatility
If solid dummy dies are used in stacked packages, then structural integrity is maintained, but functional component integration is limited
Solution Approach 1:
The dummy die is segmented into a load-bearing annular region and a removable interior region. The annular region maintains structural integrity by providing mechanical support and stress distribution, while the removed interior creates space for integrating additional functional components.
Solution Approach 2:
The annular structure acts as an intermediary element that provides both mechanical support and a framework for mounting additional functional components. It serves as a structural mediator that balances the requirements for structural integrity and functional adaptability.
Data Source
AI summary
An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.