Annular Insulative PCB Spacing for Airborne Electronics
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional electronics modules for airborne munitions are limited by increased weight and cost due to support structures and specialized connectors, which also occupy valuable space and are not amenable to automated manufacturing processes.
Innovation Solution
The use of annular insulative bodies with vias to axially space and electrically couple printed circuit boards, eliminating the need for complex support structures and enabling fully automated manufacturing, while providing robust structural support and compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If conventional support structures (tray, slide, cage) and specialized connectors are used to space and interconnect PCBs, then structural support and electrical interconnection are provided, but weight increases, cost increases, and available space within the munition shell is reduced
Solution Approach 1:
The patent combines the support structure and electrical connector functions into a single integrated component. The support structure includes integrated electrical connectors that directly connect adjacent PCBs, eliminating the need for separate support structures and specialized connectors. This merging reduces weight while maintaining both structural support and electrical interconnection capabilities.
Solution Approach 2:
The support structure is designed to perform multiple functions simultaneously: providing mechanical support for PCBs, spacing adjacent PCBs apart, and establishing electrical interconnections between them. This multi-functional design eliminates the need for multiple separate components, thereby reducing overall weight and cost.
2Strength
If conventional support structures and specialized connectors are used, then structural support and electrical interconnection are provided, but cost increases due to acquisition and manual labor costs
Solution Approach 1:
By integrating the electrical connectors into the support structure itself, the patent eliminates the need for separate specialized connectors that are expensive to acquire and install. The integrated design allows for automated assembly processes, reducing both component acquisition costs and manual labor costs associated with installation.
Solution Approach 2:
The patent employs standard manufacturing techniques and materials that can be produced through automated processes rather than requiring specialized manual assembly. The integrated support structure with built-in connectors can be manufactured as a single piece or pre-assembled unit, enabling automated placement and reducing labor costs.
3Reliability
If specialized connectors are used to interconnect PCBs, then electrical interconnection is provided, but occupied surface area of miniaturized PCBs increases undesirably
Solution Approach 1:
The patent transitions from surface-mounted connectors that occupy PCB surface area to through-hole connectors that extend through the PCB thickness dimension. This dimensional change allows electrical interconnections to be established without consuming valuable surface area on miniaturized PCBs, thereby preserving space for electronic components while maintaining reliable electrical connectivity.
4Strength
If conventional support structures are used to space PCBs, then structural support is provided, but available space within the munition shell is reduced
Solution Approach 1:
The integrated support structure with built-in connectors provides structural support and spacing functions in a more compact configuration than conventional separate support structures. This merging eliminates the need for additional spacing components, thereby maximizing the available space within the constrained volume of the munition shell.
Data Source
Figure 1~2
Figure 3
Figure 4~6
AI summary
An electronics module is provided for utilization onboard an airborne object. In one embodiment, the electronics module includes a housing having a cavity therein, a first printed circuit board (PCB) disposed in the cavity, a second PCB disposed in the cavity above the first PCB, and a supportive interconnect structure. The supportive interconnect structure includes a substantially annular insulative body and a plurality of vias. The substantially annular insulative body extends around an inner circumferential portion of the housing between the first PCB and the second PCB to support the second PCB and to axially space the second PCB from the first PCB. The plurality of vias is formed through the substantially annular insulative body and electrically couples the first PCB to the second PCB.