Annular Interposers for Semiconductor Package Thermal Management
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Solution Overview
Problem
Semiconductor packages with vertically stacked dies face challenges in thermal management due to heat generation and the high cost and limited thermal contribution of annular lower lids, which occupy significant volume without effectively addressing thermal issues.
Innovation Solution
The implementation of annular interposers that surround the stack of semiconductor dies, providing additional space for circuit elements and improving thermal management by allowing for better integration of an upper lid, which can be mechanically and thermally connected to the die stack and substrate, while reducing the need for expensive annular lower lids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If annular lower lids are used to provide mechanical stability and thermal conduction, then mechanical stability is improved, but manufacturing cost increases and thermal management effectiveness decreases
Solution Approach 1:
The patent removes the annular lower lid from the package structure, extracting the problematic component that caused high manufacturing costs and poor thermal performance. The lid is completely eliminated while its mechanical support function is replaced by bonding the upper lid directly to the substrate, and its thermal conduction function is replaced by the interposer and substrate thermal paths.
Solution Approach 2:
The substrate is given multiple functions: it provides mechanical support (replacing the lower lid's structural role), thermal conduction path (replacing the lower lid's thermal role), and electrical interconnection (through TSVs). The interposer also serves dual purposes of mechanical support and thermal management.
2Temperature
If annular lower lids are used to provide thermal conduction, then thermal management is improved, but volume efficiency decreases
Solution Approach 1:
The annular lower lid is completely removed from the package structure, eliminating the volume it occupied. This extraction reduces the overall package volume while maintaining thermal management through alternative paths via the substrate and interposer.
Solution Approach 2:
The patent shifts thermal management from a lateral approach (annular lid surrounding the die stack) to a vertical approach (direct bonding and thermal conduction through the substrate and interposer). This dimensional change eliminates the need for lateral space-consuming components.
3Productivity
If vertically stacked dies are used to increase functional capacity, then functional capacity is improved, but thermal management difficulty increases
Solution Approach 1:
The interposer serves as an intermediary component between the die stack and substrate, providing a dedicated thermal conduction path. It mediates the thermal management challenge by creating a direct thermal bridge that efficiently conducts heat away from the stacked dies without requiring complex lateral thermal management structures.
Solution Approach 2:
The patent addresses thermal management by transitioning from lateral heat dissipation approaches to vertical heat conduction through the interposer and substrate. This vertical thermal path efficiently handles the heat generated by stacked dies without increasing package footprint or complexity.
4Strength
If annular lower lids are used to provide mechanical support, then die protection is improved, but device complexity increases
Solution Approach 1:
The annular lower lid is extracted from the package structure, simplifying the overall design by removing a complex component. Its mechanical protection function is transferred to the substrate and bonding structure, which provide die support and protection without requiring a separate annular lid component.
Solution Approach 2:
The mechanical support and protection functions previously separated into distinct components (lower lid and substrate) are merged into an integrated bonding structure. The upper lid is directly bonded to the substrate, creating a unified mechanical support system that eliminates the need for a separate annular lower lid.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances thermal management and space efficiency in semiconductor packages by allowing for additional circuit elements and improved heat conduction, reducing the volume occupied by lids and lowering manufacturing costs.
Implementation Method 1
a thermally conductive lid attached to both the die stack (for better thermal conduction) and the substrate (for better mechanical stability and die protection)
Data Source
AI summary
A semiconductor device package is provided. The package can include a stack of semiconductor dies over a substrate, the substrate including a plurality of electrical contacts, and an annular interposer disposed over the substrate and surrounding the stack of semiconductor dies. The annular interposer can include a plurality of circuit elements each electrically coupled to at least a corresponding one of the plurality of electrical contacts. The package can further include a lid disposed over the annular interposer and the stack of semiconductor dies.