Annular Metal Layer Teeth for Substrate Cutting

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Solution Overview

Problem

The existing manufacturing process of electronic devices with support substrates and encapsulating covers faces difficulties in delamination of metal layers during sawing and excess substrate material beyond the encapsulating covers.

Innovation Solution

The proposed solution involves a support substrate with an annular local metal layer having spaced-apart teeth forming notches, and encapsulating covers with a bonding material that overlaps the metal layer, allowing for precise cutting between covers to minimize substrate excess and maintain metal layer attachment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the support substrate is provided with peripheral metal layers above which the encapsulating covers are fixed, then the electronic device can be manufactured collectively, but delamination of the metal layers occurs during sawing of the support substrate between the metal covers and through the metal layers

Engineering Contradiction:
Improvecollective manufacturingVSAvoidmetal layer attachment
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The annular metal layer is segmented into multiple spaced-apart teeth extending in the radial direction, forming notches between them. This segmentation allows the sawing blade to pass through the notches during cutting, preventing delamination of the metal layer from the support substrate while maintaining collective manufacturing capability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The teeth of the annular metal layer are preliminarily positioned to extend into the areas for subsequent cutting between the encapsulating covers. This preliminary arrangement of the metal layer structure anticipates the cutting operation, ensuring that the sawing blade can pass through the notches without causing delamination during the actual cutting process.

Inventive Principle:
Principle #10Preliminary action

2Strength

If the support substrate extends beyond the encapsulating covers, then the substrate provides structural support, but excess substrate material increases device size and requires additional processing

Engineering Contradiction:
Improvesubstrate structural supportVSAvoidsubstrate extension area
Core Design Contradiction:
StrengthVSArea of stationary object

Solution Approach 1:

The annular metal layer is divided into spaced-apart teeth that create notches, allowing the substrate to be precisely cut to size. This segmentation enables the substrate to extend beyond the encapsulating covers for structural support while allowing precise trimming to minimize excess material.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The bonding material acts as an intermediary between the encapsulating cover and the annular metal layer, extending over the teeth and notches. This intermediary structure secures the metal layer to the substrate during cutting and assembly, allowing the substrate to extend beyond the covers while maintaining structural integrity.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Ease of manufacture

If the annular metal layer is provided with spaced-apart teeth forming notches, then cutting between encapsulating covers becomes efficient, but the metal layer structure becomes more complex

Engineering Contradiction:
Improvecutting efficiencyVSAvoidmetal layer structure
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The annular metal layer is segmented into spaced-apart teeth that form notches between them. This segmentation directly facilitates efficient cutting by allowing the sawing blade to pass through the notches, while the segmented structure itself is relatively simple to manufacture using standard metal deposition and patterning techniques.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10892201B2Electronic device comprising a support substrate and an encapsulating cover for an electronic component
Publication Date: 2021.01.12 STMICROELECTRONICS INT NV
  • US10892201B2 patent drawing
  • US10892201B2 patent drawing
  • US10892201B2 patent drawing

AI summary

A support substrate has a face above which at least one electronic component is fixed. A peripheral area of the face includes an annular local metal layer. An encapsulating cover for the electronic component includes a peripheral wall having an end edge that is mounted above the peripheral area. The annular metal local layer includes, at the periphery thereof, a series of spaced-apart teeth with notches formed therebetween. The teeth extend as far as the peripheral edge of the support substrate.