Annular Polymer Ring for IC Package Delamination Prevention
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Solution Overview
Problem
The semiconductor industry faces challenges in miniaturization and packaging efficiency, particularly in preventing delamination and crack formation in integrated circuit packages during manufacturing and operation, which affects the reliability of stacked semiconductor devices.
Innovation Solution
The formation of protective rings around vias using a polymer material, such as UV-curable or thermosetting polymers, around the encapsulant and conductive vias, which prevents delamination and crack propagation by creating an annular-shaped structure that separates the encapsulant from the underfill material at the interface with the conductive vias and connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If stacked semiconductor devices are used to reduce physical size, then integration density and miniaturization are improved, but delamination and crack formation occur at interfaces between encapsulant and underfill material
Solution Approach 1:
A protective ring structure is introduced as an intermediary element between the encapsulant and underfill material at the via interface. This protective ring prevents direct contact between these two materials at the via location, thereby eliminating the delamination and crack formation that occurs at their interface. The protective ring acts as a mediator that resolves the reliability issue while maintaining the miniaturized stacked device architecture.
Solution Approach 2:
The protective ring is formed in advance during the manufacturing process, before the underfill material is applied. This pre-formed protective structure provides beforehand cushioning or protection at the via interface, preventing delamination and crack formation before they can occur during subsequent packaging or operation. The protective ring is positioned and cured prior to underfill application to ensure reliability from the outset.
2Reliability
If protective rings are formed around vias using polymer material, then delamination and crack formation are prevented, but additional manufacturing steps are required
Solution Approach 1:
The formation of the protective ring is merged with the existing encapsulant formation process. The same dispensing apparatus and curing process used for the encapsulant are utilized to form the protective ring, combining two manufacturing steps into one. This reduces the additional complexity that would arise from introducing a completely separate process while still achieving the reliability improvement.
Solution Approach 2:
The encapsulant formation process is given multi-functionality by enabling it to perform both its original protective function and the additional function of forming the protective ring around vias. The polymer material and curing process serve dual purposes: creating the encapsulant structure and simultaneously creating the protective ring feature. This universality reduces manufacturing complexity by eliminating the need for dedicated protective ring formation equipment and processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the reliability of integrated circuit packages by reducing delamination and crack formation, thereby improving the manufacturing process efficiency and reducing manufacturing costs.
Implementation Method 1
The polymer material may comprise a UV curable polymer material. Curing the polymer material may comprise exposing the polymer material to UV light.
Implementation Method 2
The polymer material may comprise a thermally curable polymer material. Curing the polymer material may comprise performing a thermal treatment on the polymer material.
Data Source
AI summary
An integrated circuit package and a method of forming the same are provided. A method includes forming a conductive column over a carrier. An integrated circuit die is attached to the carrier, the integrated circuit die being disposed adjacent the conductive column. An encapsulant is formed around the conductive column and the integrated circuit die. The carrier is removed to expose a first surface of the conductive column and a second surface of the encapsulant. A polymer material is formed over the first surface and the second surface. The polymer material is cured to form an annular-shaped structure. An inner edge of the annular-shaped structure overlaps the first surface in a plan view. An outer edge of the annular-shaped structure overlaps the second surface in the plan view.