Annular Radiator Layout for Low-Resistance PCB Module Cooling

The radiator is divided into multiple heat dissipation fin groups (first, second, third, and fourth fin groups) with different fin numbers and intervals. This segmentation allows each group to be optimized independently - some groups have higher fin density for heat dissipation while others have lower fin density for reduced flow resistance, resolving the contradiction between maximizing heat dissipation area and minimizing flow resistance.

Different regions of the radiator are designed with different fin characteristics. The first and second fin groups have different fin numbers and intervals from the third and fourth fin groups. This local differentiation enables areas closer to the heat source to have optimized fin density for heat transfer, while other areas have adjusted density to maintain airflow, thus resolving the uniform design limitation.

By segmenting the radiator into multiple fin groups with different characteristics, the system can maintain adequate heat dissipation area through aggregated surface area across all groups while allowing individual groups to have reduced fin density for lower flow resistance. The cumulative effect of multiple groups compensates for the reduced area in any single group.

The patent introduces the dimension of spatial distribution by arranging heat dissipation fins in multiple groups at different locations and orientations. This transforms the problem from a single-dimension trade-off (fin density vs. flow resistance) to a multi-dimensional solution where total heat dissipation area is distributed across multiple zones with varying local characteristics.