Annular Radiator for Power Semiconductor Heat Dissipation
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Solution Overview
Problem
Existing power semiconductor devices face challenges with heat dissipation due to the large size and complex structure of traditional radiator components, particularly in planar arrangements and water-cooling systems, which hinder compactness and efficiency.
Innovation Solution
A radiator component with an annular structure comprising an inner-ring and outer-ring substrate, heat sinks, and a fan component, allowing for even heat distribution and improved airflow, reducing space occupation and costs while enhancing cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a planar radiator arrangement is used, then the structure is simple, but the heat dissipation system occupies large space and lacks compactness
Solution Approach 1:
The patent transitions from a planar (2D) radiator arrangement to a three-dimensional annular structure. The annular heat dissipation body with inner and outer ring substrates creates a radial configuration that utilizes vertical and radial dimensions, achieving compact space occupation while maintaining structural simplicity through the continuous环形 design.
Solution Approach 2:
The annular structure naturally creates nested zones with an inner-ring substrate and an outer-ring substrate forming concentric rings. This nested annular configuration allows multiple functional zones to be packed efficiently within a compact radial footprint, reducing overall space occupation while maintaining simplicity.
2Reliability
If multiple fans are used in planar arrangement, then cooling coverage is improved, but air flow disturbances occur between fans
Solution Approach 1:
The patent consolidates multiple fan functions into a single fan component positioned at the center of the annular structure. This single fan creates a unified radial airflow pattern that flows uniformly through the heat sinks arranged in the annular configuration, eliminating air flow disturbances between multiple fans while maintaining comprehensive cooling coverage through the radial flow distribution.
3Reliability
If water-cooling system is used, then heat dissipation efficiency is improved, but the system size and structural complexity increase
Solution Approach 1:
The patent replaces the water-cooling system (hydraulic/mechanical system requiring pumps, channels, and coolant circulation) with an air-cooling system using a fan component. The annular heat dissipation body with radially arranged heat sinks efficiently dissipates heat through forced air convection, achieving comparable heat dissipation efficiency while dramatically reducing system structural complexity and eliminating the need for water circulation infrastructure.
4Reliability
If air cooling with multiple fans is used, then heat dissipation capacity is improved, but the number of components and cost increase
Solution Approach 1:
The patent merges multiple fan components into a single central fan that serves the entire annular heat dissipation structure. This single fan generates radial airflow that uniformly cools all heat sinks arranged between the inner and outer ring substrates, maintaining adequate heat dissipation capacity while reducing the number of components from multiple fans to just one, thereby lowering cost and simplifying the system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The annular structure provides a more compact and cost-effective heat dissipation system that improves cooling efficiency by optimizing airflow and reducing the need for multiple fans, addressing the inefficiencies of planar arrangements and water-cooling systems.
Implementation Method 1
a fan component... to suck air or blow air to carry away heat generated by the power semiconductor device
Implementation Method 2
a plurality of heat sinks, arranged between the inner-ring substrate and the outer-ring substrate
Implementation Method 3
heat sinks... to carry away heat generated by the power semiconductor device
Data Source
AI summary
Embodiments disclose a radiator component and a heat dissipation system for a power semiconductor device. The radiator component for a power semiconductor device includes a heat dissipation body including an inner-ring substrate, an outer-ring substrate, and a plurality of heat sinks. In an embodiment, the outer-ring substrate surrounds the inner-ring substrate and the plurality of heat sinks are arranged between the inner-ring substrate and the outer-ring substrate. One or more first power semiconductor device arrangement positions are provided on an inner circumferential surface of the inner-ring substrate and one or more second power semiconductor device arrangement positions are arranged on an outer circumferential surface of the outer-ring substrate. The radiator component further includes a fan component. The embodiments can save on space, reduce costs, improve the heat dissipation efficiency, and avoid the problem of disturbances between a plurality of fans.