Annular Semiconductor Grooves for Thermoelectric Module Assembly
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Solution Overview
Problem
The production of tubular thermoelectric modules is complex due to the need for precise arrangement of semiconductor elements between inner and outer tubes, with challenges in thermal expansion and assembly, leading to potential component destruction and high production costs.
Innovation Solution
A ring-shaped semiconductor element with radial grooves and a ring-shaped insulating material with a radial slit are designed to facilitate assembly and thermal stress management, allowing for easy installation and efficient heat transport while maintaining electrical insulation and conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If semiconductor elements are arranged between inner tube and outer tube with insulating material and electrically conductive connections, then the thermoelectric module can be constructed, but the production becomes very complex and assembly difficulty increases
Solution Approach 1:
The semiconductor element is divided into multiple segments along the radial direction, with each segment separated by grooves. This segmentation allows the elements to be arranged more easily between the inner and outer tubes while reducing the complexity of precise positioning and assembly of the entire ring structure.
Solution Approach 2:
An insulating material with a radial slit is introduced as an intermediary component between the semiconductor elements and the tubes. This insulating material facilitates assembly by providing a structured interface that simplifies the arrangement of multiple components while maintaining electrical insulation and thermal contact.
2Reliability
If thermal expansion of individual components is not managed, then component destruction may occur, but managing thermal expansion increases design complexity
Solution Approach 1:
The semiconductor element is segmented into multiple parts by radial grooves, allowing each segment to expand and contract independently in response to thermal changes. This reduces thermal stress accumulation and prevents component destruction while maintaining the overall structural integrity of the thermoelectric module.
Solution Approach 2:
The grooves are strategically positioned at specific locations on the semiconductor element where thermal stress is most likely to occur. This localized structural modification allows the element to accommodate thermal expansion in critical areas while maintaining structural strength in other regions.
3Reliability
If grooves are added to semiconductor elements for stress management, then thermal stress is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The grooves are pre-formed in the semiconductor elements during the manufacturing process, creating predetermined breaking points and stress relief features before the elements are assembled into the thermoelectric module. This preliminary structuring simplifies the overall manufacturing process by integrating stress management into the base component fabrication.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution simplifies the assembly of thermoelectric modules, reduces thermal stresses, and enhances the efficiency and durability of the modules by allowing for targeted breaking points and efficient heat flow without compromising electrical performance.
Implementation Method 1
Thermoelectric materials for this depend on a type that they can effectively convert thermal energy into electrical energy (Seebeck effect)
Implementation Method 2
Thermoelectric materials for this depend on a type that they can effectively convert thermal energy into electrical energy (Seebeck effect) and vice versa (Peltier effect)
Implementation Method 3
the groove forms a predetermined breaking point for the semiconductor element, which can optionally be used during assembly and/or operation of the thermoelectric module. In particular, thermal stresses occurring during assembly and/or during operation can be reduced by a targeted breaking open of the groove
Data Source
Figure 1~2
Figure 3~4
Figure 5~6
AI summary
The invention relates to an annular semiconductor element (1) for producing a thermoelectric module (14). The semiconductor element (1) has at least one groove (2) extending in a radial direction (3) from an inner peripheral surface (18) to an outer peripheral surface (19), and an annular insulation material (9) to insulate (21) n-doped and p-doped semiconductor elements (1) and to be arranged accordingly on a lateral face (25) of the semiconductor elements (1). The insulation material (9) has a slit (11) which extends in the radial direction (3) and divides the insulation material (9).