Annular Semiconductor Device for Motor Mounting

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Solution Overview

Problem

Conventional semiconductor devices with a rectangular plan view struggle when attached to annular or partially-annular surfaces, leading to wasted space and increased wiring burden due to protrusion or inability to fit within the surface.

Innovation Solution

A semiconductor device with a substrate and sealing resin that are annular or partially annular in shape, allowing for effective utilization of the attaching surface and reducing wiring complexity by configuring the circuit units to control multiple phases on a single substrate, which is arcuate in plan view to match the surface shape.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a rectangular semiconductor device is attached to an annular or partially-annular attaching surface, then the device structure is simple and easy to manufacture, but the attaching surface cannot be effectively utilized and the device may protrude from the surface

Engineering Contradiction:

Improveease of manufactureVSAvoidutilization of attaching surface

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The substrate is designed with an annular or partially-annular shape that matches the curvature of the attaching surface, allowing the semiconductor device to conform to the surface geometry and effectively utilize the available attaching area without protrusion

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Ease of manufacture

If a rectangular semiconductor device is attached to an annular or partially-annular attaching surface, then the device structure is simple, but the wiring burden increases due to protrusion and misalignment

Engineering Contradiction:

Improveease of manufactureVSAvoidwiring burden

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

The annular substrate shape conforms to the attaching surface, enabling proper alignment of connection portions with the attaching surface, thereby reducing wiring burden and avoiding the complexity associated with protrusion and misalignment

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Area of stationary object

If the substrate is made annular or partially annular to match the attaching surface, then the utilization of attaching surface is improved, but the device structure becomes more complex

Engineering Contradiction:

Improveutilization of attaching surfaceVSAvoiddevice structure

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The annular substrate serves multiple functions: it matches the attaching surface geometry for effective utilization, provides a platform for mounting the circuit unit, and facilitates proper alignment of connection portions, thereby reducing overall device complexity despite the non-rectangular shape

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS10276466B2Semiconductor device and semiconductor device mounting method

Publication Date: 2019.04.30 SHINDENGEN ELECTRIC MANUFACTURING CO LTD

AI summary

A semiconductor device of the present invention includes: a substrate (12) that is annular or partially annular, the substrate (12) having an inner circumferential portion (20) formed arcuate in plan view and an outer circumferential portion (21) formed arcuate in plan view; a circuit unit (13) provided on the substrate (12), the circuit unit (13) being configured to individually control a plurality of phases of a motor; and a sealing resin (18) that is circular annular or partially circular annular and is concentric to the substrate (12), the sealing resin (18) surrounding the substrate (12).