Annular Semiconductor Substrate Wiring for Inductance Reduction
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Solution Overview
Problem
Conventional power semiconductor devices are susceptible to inductance caused by power supply current due to long or complex wirings, which can affect their performance.
Innovation Solution
A semiconductor device with a substrate having annular or partially annular regions, where power supply and ground wirings are strategically arranged on the inner and outer circumferential sides of the substrate, extending in the circumferential direction to minimize inductance, and are connected to phase control circuits controlling a motor's phases.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If power supply wirings and ground wirings are arranged conventionally in each module, then each module can be independently configured, but the wiring length becomes long and complex, increasing susceptibility to inductance
Solution Approach 1:
The patent merges the power supply wiring and ground wiring arrangements from multiple independent modules into a single integrated substrate. The power supply wiring extends in the circumferential direction and connects multiple phase control circuits, while the ground wiring is arranged on the opposite side, creating a unified power distribution system that reduces overall wiring length and complexity.
Solution Approach 2:
The patent transitions from a conventional linear or planar wiring arrangement to a radial/annular configuration on a circular substrate. The power supply wiring is positioned on one side of the phase control circuits while the ground wiring is positioned on the opposite side, utilizing the circumferential dimension to minimize wiring length and reduce inductance effects.
2Reliability
If wiring length is reduced to minimize inductance, then susceptibility to inductance decreases, but the substrate configuration becomes more complex
Solution Approach 1:
The patent employs a circular or annular substrate configuration instead of a conventional rectangular shape. The phase control circuits are arranged radially around the substrate center, with power supply wiring positioned on one circumferential side and ground wiring on the opposite side. This curved/annular geometry naturally minimizes wiring length while maintaining structural integrity.
3Ease of manufacture
If multiple modules are connected by metal connecting plates, then each module can be independently manufactured, but the overall device size and wiring complexity increase
Solution Approach 1:
The patent combines multiple phase control circuits and their associated power supply and ground wirings onto a single substrate, eliminating the need for separate metal connecting plates between modules. This integration maintains manufacturing efficiency while dramatically reducing wiring length and eliminating the wiring complexity associated with connecting multiple independent modules.
Data Source
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AI summary
A semiconductor device of the present invention includes: a substrate (12) that is annular or partially annular; a first phase control circuit (14) provided on the substrate (12), the first phase control circuit being configured to control a first phase of a plurality of phases of a motor; a second phase control circuit (15) provided on the substrate (12) so as to be adjacent to the first phase control circuit (14) in a circumferential direction of the substrate (12), the second phase control circuit (15) being configured to control a second phase of the plurality of phases of the motor, the second phase being different from the first phase; a power supply wiring (18) disposed on one of an outer circumferential side and an inner circumferential side of the first phase control circuit (14) and the second phase control circuit (15) in a radial direction of the substrate (12), the power supply wiring (18) being connected to the first phase control circuit (14) and the second phase control circuit (15), and the power supply wiring (18) extending in the circumferential direction of the substrate (12); and a ground winding (19) disposed on an other one of the outer circumferential side and the inner circumferential side of the first phase control circuit (14) and the second phase control circuit (15) in the radial direction of the substrate (12), the ground winding (19) being connected to the first phase control circuit (14) and the second phase control circuit (15), and the ground winding (19) extending in the circumferential direction of the substrate (12).