Power control device, electrical motor, air conditioner, and method for manufacturing electrical motor
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Solution Overview
Problem
Conventional electric-power control devices for motors suffer from excessive temperature rise of microcomputers due to direct heat transmission from power ICs via shared ground electrodes, which affects their performance and reliability.
Innovation Solution
The design incorporates separate ground pattern portions on the substrate for the power semiconductor module and microcomputer, with a connection portion to minimize heat transmission, allowing for efficient heat dissipation and reduced temperature rise of the microcomputer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single ground electrode pattern is used to connect both power IC and microcomputer grounds, then the device complexity is reduced and manufacturing is simplified, but heat generated at the power IC is directly transmitted to the microcomputer causing temperature rise
Solution Approach 1:
The ground electrode pattern is divided into two separate patterns: a first ground pattern connected to the power IC ground terminal and a second ground pattern connected to the microcomputer ground terminal. This segmentation prevents heat generated at the power IC from being directly transmitted to the microcomputer through the ground connection, while still providing separate ground paths for both components.
Solution Approach 2:
A connection portion is introduced as an intermediary element that connects the first ground pattern and the second ground pattern. This connection portion is positioned away from the microcomputer, acting as a mediator that allows the two ground patterns to be electrically connected while preventing direct heat transmission to the microcomputer.
2Temperature
If separate ground pattern portions are used for power semiconductor module and microcomputer, then heat transmission to microcomputer is reduced, but the device complexity increases
Solution Approach 1:
The first ground pattern, second ground pattern, and connection portion are merged to form an integrated ground structure on the substrate. This merging approach allows the separate ground patterns to be implemented as a unified design, reducing the overall complexity compared to using completely separate ground connections for each component.
3Loss of energy
If separate ground patterns with connection portion are implemented, then manufacturing complexity increases, but heat dissipation performance improves
Solution Approach 1:
The ground electrode pattern is designed with local quality variations: the first ground pattern has a larger area closer to the power IC for effective heat dissipation, while the connection portion has a smaller area positioned away from the microcomputer to minimize heat transmission. This local differentiation optimizes heat management while maintaining manufacturing feasibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the temperature of the microcomputer, enhancing its operational reliability and allowing for higher-speed operation without increasing the guaranteed temperature, thus improving motor control efficiency and output.
Implementation Method 1
heat generated at the power IC is directly transmitted to the microcomputer via the ground electrode
Data Source
Figure 1
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Figure 4
AI summary
An electric-power control device including a substrate of an annular shape in which a through hole is formed and a connector is arranged in a peripheral part, the electric-power control device driving an electric motor. On the substrate, a power semiconductor module is mounted on a first region on one side relative to a straight line connecting the center of the through hole to the center of the connector, and a microcomputer is mounted on a second region on the other side. Furthermore, a first ground pattern part that is formed extending from the power semiconductor module toward the connector in the first region and a second ground pattern part that is formed extending from the microcomputer toward the connecter in the second region are provided on the substrate.