Insoluble Anode Copper Electroplating Bubble Management
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Solution Overview
Problem
The existing insoluble anode copper electroplating process faces issues with oxygen bubble accumulation, leading to uneven current distribution and reduced plating quality, as well as high consumption of electroplating additives due to anode coating decomposition.
Innovation Solution
An optimized method and device for insoluble anode acid sulfate copper electroplating using a mesh or perforated plate anode with liquid outlet and ejecting pipes to manage oxygen bubbles and a reverse-pulse protective screen to reduce hydrogen generation, along with an electroplating cell divider to minimize additive consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional insoluble anode electroplating is used, then copper plating can be deposited on cathode, but oxygen bubbles accumulate on anode surface causing uneven current distribution and reduced plating quality
Solution Approach 1:
The patent extracts and removes oxygen bubbles from the electroplating system by introducing a gas-liquid separator that separates gas bubbles from the electroplating solution, preventing bubble accumulation on the anode surface and eliminating the harmful effect of uneven current distribution
Solution Approach 2:
The patent uses hydraulic flow control through liquid outlet and ejecting pipes to manage the electroplating solution circulation, creating controlled fluid dynamics that prevent bubble accumulation and maintain uniform current distribution across the anode surface
2Manufacturing precision
If reverse pulse current is applied to optimize plating, then copper dissolution and uniformity improve, but hydrogen generation damages the anode coating
Solution Approach 1:
The patent applies periodic reverse pulse current to the electroplating system, alternating between forward and reverse polarity cycles. This periodic action enables copper dissolution during forward pulses for uniform plating, while reverse pulses prevent hydrogen accumulation and coating damage through controlled electrochemical reactions
Solution Approach 2:
The patent changes the electrical parameters by implementing reverse pulse current with controlled amplitude and duty cycle, modifying the electrochemical environment to achieve both improved plated layer uniformity and reduced hydrogen generation damage to the anode coating
3Manufacturing precision
If insoluble anode is used for stable electroplating solution composition, then plating uniformity improves, but electroplating additives are consumed due to anode coating decomposition
Solution Approach 1:
The patent extracts and removes decomposed anode coating materials and excessive additives from the electroplating solution using a filtration system, preventing their accumulation and reducing the rate of additive consumption while maintaining stable solution composition
Solution Approach 2:
The patent implements a system to discard decomposed anode coating materials and recover valuable electroplating additives from the solution through filtration and circulation, reducing additive loss and extending the service life of the electroplating solution
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves plating uniformity and efficiency by removing oxygen bubbles and extending anode coating life, while reducing additive consumption and maintaining high electroplating quality.
Implementation Method 1
The electrochemical reactions at the anode for the two types of acid sulfate copper electroplating processes are as follows: (2) Copper electroplating process with insoluble anode H2O−2e−→1/2O2↑+2H+
Implementation Method 2
copper ions in the electroplating solution are reduced to metallic copper on the surface of the cathode (the part to be coated)
Data Source
AI summary
The present invention provided an optimized method for an insoluble anode acid sulfate copper electroplating process, comprising following steps: providing an insoluble anode made of coated titanium in the form of a mesh or a perforated plate; providing at least one liquid outlet pipe/port on the side of the insoluble anode away from the cathode, to generate a liquid flow of an electroplating solution by overflow and/or power driven suction at the liquid outlet pipe/port; initiating an electroplating process by switching on an electroplating power supply, while the electroplating solution flows away due to the overflow and/or power driven suction at the liquid outlet pipe/port, the electroplating solution in the electroplating cell forms a liquid flow towards the liquid outlet pipe/port, and accordingly, adding electroplating solution to the electroplating cell to maintain the liquid volume in the cell until the electroplating process is completed and the electroplated cathode is removed.