Anodic Bonding of Curved Surfaces via Distributed Pressing Force
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Solution Overview
Problem
Conventional solid body joining techniques, such as anodic bonding, are limited to joining planar surfaces and fail to provide stable connections for curved surfaces, like aspherical mirrors, which are necessary for applications in space and optics, due to uneven bond fronts and mechanical instability.
Innovation Solution
A method for anodic bonding that applies a multidirectionally distributed pressing force to a cover layer, ensuring full contact with a curved carrier body surface, using a pressure intermediary device to maintain contact perpendicularly across the surface, allowing for a gap-free, stable connection between curved surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional anodic bonding is used to join planar surfaces, then the bond connection can be created, but the bond front migrates unevenly causing gaps in the connection
Solution Approach 1:
The method applies a pressing force to the cover layer before and during the anodic bonding process to pre-establish full contact between the bonding surfaces. This preliminary action ensures that the bond front migrates uniformly across the entire surface area, preventing gap formation and improving connection reliability
Solution Approach 2:
The invention introduces a pressing force parameter that is applied to the cover layer, changing the physical state of the bonding interface from loose to fully contacted. This parameter change ensures uniform bond front migration and eliminates the uneven bonding observed in conventional processes
2Adaptability or versatility
If conventional anodic bonding is applied to curved surfaces, then joining of curved surfaces is attempted, but the connection becomes mechanically unstable
Solution Approach 1:
The pressing force is applied to the cover layer before bonding to ensure full contact with the curved carrier body surface. This preliminary action maintains stable contact during the bonding process, enabling reliable joining of curved surfaces for applications like aspherical mirrors
Solution Approach 2:
The invention applies a pressing force parameter that adapts to curved surfaces, maintaining full contact between the cover layer and carrier body. This parameter change enables mechanical stability on curved surfaces while expanding adaptability to different geometries
3Ease of manufacture
If a glass cover layer is applied by sputtering or CVD on a curved carrier body, then coating can be deposited, but the layer thickness is limited and mechanical processing is restricted
Solution Approach 1:
The invention uses a pressing force parameter during bonding that enables full contact between the cover layer and curved carrier body, allowing for thicker glass layers to be bonded without limiting thickness constraints. This enables subsequent mechanical processing to achieve aspherical surfaces with better precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the creation of a stable, gap-free, and homogeneous joining region between curved surfaces, enhancing the mechanical and temperature stability of composite components, particularly optical components like mirrors, while overcoming limitations of conventional techniques.
Implementation Method 1
By way of example, in DE 10 2009 011 863, an optical mirror comprising a ceramic carrier body with a planar surface and a glass cover layer is disclosed, wherein the glass cover layer is connected by anodic bonding to the surface of the ceramic carrier body.
Implementation Method 2
When an electric potential and heat are applied to the bonding partners, ions, for example, potassium and sodium ions, migrate away from the boundary surface of the glass cover layer and the ceramic carrier body.
Implementation Method 3
the cover layer is pressed with a pressing force against a curved carrier body surface. According to the invention, a multidirectionally distributed pressing force is generated with which the cover layer is pressed areally against the curved carrier body surface
Implementation Method 4
When an electric potential and heat are applied to the bonding partners, ions, for example, potassium and sodium ions, migrate away from the boundary surface
Data Source
AI summary
In a method for solid body joining of a carrier body (10) and a cover layer (20), in particular by anodic bonding, the cover layer (20) is pressed with a pressing force against a curved carrier body surface (11), wherein the pressing force during the solid body joining is distributed by way of a pressure intermediary device (30) areally and simultaneously over the whole cover layer (20) and is directed perpendicularly to the curvature of the carrier body surface (11). A composite component comprising a carrier body (10) and a cover layer (20) is also disclosed, wherein a curved areal joining region (13) is formed between a cover layer surface (21) and a carrier body surface (11).