Anodic Oxide Probe Card Guide Plate with Buffer Parts
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Solution Overview
Problem
Existing ceramic guide plates for probe cards face challenges with probe pin insertion due to low transmittance, increased manufacturing time and cost, thermal deformation, and surface damage from pin holding portions.
Innovation Solution
A guide plate system comprising a first anodic oxide film guide plate with transparent pin insertion holes and a second opaquely colored or ceramic guide plate with buffer parts made of polymer or SU-8 photoresist, facilitating probe pin insertion and preventing surface damage, while maintaining thermal stability and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser light irradiation is used to form through-holes in ceramic guide plate, then through-holes can be formed, but thermal deformation occurs and manufacturing time and cost increase
Solution Approach 1:
The patent replaces the laser irradiation process with a mechanical drilling process. The guide plate is formed by drilling through-holes using a drill bit, which is a mechanical method. This substitution eliminates the thermal effects and time consumption associated with laser irradiation while achieving the same functional result of creating through-holes for probe pin insertion.
2Manufacturing precision
If laser light irradiation is used to form through-holes in ceramic guide plate, then through-holes can be formed, but manufacturing cost increases
Solution Approach 1:
The patent replaces the expensive laser irradiation process with a simpler mechanical drilling process. The guide plate is formed by drilling through-holes using a drill bit, which is a mechanical method. This substitution eliminates the high equipment cost and operational cost associated with laser irradiation while achieving the same functional result of creating through-holes for probe pin insertion.
3Strength
If ceramic material is used for guide plate, then structural strength is provided, but transmittance is low and probe pin insertion is difficult
Solution Approach 1:
The patent applies local quality by creating through-holes with specific dimensions and positions in the guide plate. The through-holes are designed with appropriate diameter and alignment to facilitate probe pin insertion while maintaining the overall structural integrity of the ceramic guide plate. This localized modification allows the ceramic material to provide strength where needed while enabling easy insertion where required.
4Reliability
If pin holding portions are formed on probe pins, then probe pins are prevented from separation, but surface damage to guide plate occurs
Solution Approach 1:
The patent applies beforehand cushioning by providing a buffer part on the guide plate at the location where pin holding portions will contact during insertion. This buffer part acts as a cushioning element that absorbs the impact and prevents direct contact between the pin holding portions and the guide plate surface, thereby preventing surface damage while maintaining the reliability of probe pin retention.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy insertion of probe pins, prevents surface damage, and maintains thermal stability and alignment, reducing manufacturing time and cost.
Implementation Method 1
a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film
Implementation Method 2
a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate
Data Source
AI summary
The present invention provides a guide plate for a probe card. The guide plate for the probe card according to the present invention includes: a first guide plate including a plurality of first pin insertion holes formed therein, and made of an anodic oxide film; and a second guide plate disposed to be spaced apart from the first guide plate by a predetermined distance, and including a plurality of second pin insertion holes through which probe pins passing through the first pin insertion holes pass, wherein a buffer part is provided at least partially on each of an upper portion and a lower portion of the first guide plate.


