Anodic Oxide Guide Plate Probe Card for Miniaturization

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current probe cards face challenges in reducing the size and pitch of probe insertion holes while maintaining mechanical strength and positional accuracy, particularly due to limitations in materials like ceramic, resin, and silicon, which also struggle with heat dissipation and thermal expansion during burn-in tests.

Innovation Solution

A probe card design utilizing anodic oxide film material for the guide plates, with reinforcing plates made of Si3N4 or ceramic, allowing for smaller and more uniform guide holes and improved mechanical strength, and enhanced heat dissipation by exposing metal surfaces.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If the size and pitch of probe insertion holes are reduced to meet miniaturization demands, then the thickness of probes can be reduced, but the mechanical strength of the guide plate decreases

Engineering Contradiction:

Improveprobe thicknessVSAvoidguide plate mechanical strength

Core Design Contradiction:

Length of moving objectVSStrength

Solution Approach 1:

The guide plate is constructed as a composite structure combining ceramic material (for hardness and wear resistance) and metal material (for mechanical strength and toughness). This composite construction allows the guide plate to maintain sufficient mechanical strength even when the probe insertion holes are reduced in size and pitch, thereby enabling probe miniaturization without compromising structural integrity.

Inventive Principle:

Principle #40Composite materials

2Strength

If ceramic material is used for the guide plate to ensure mechanical strength and thermal expansion compatibility, then mechanical strength is improved, but the process for forming through-holes becomes complicated and costly

Engineering Contradiction:

Improveguide plate mechanical strengthVSAvoidthrough-hole formation process

Core Design Contradiction:

StrengthVSEase of manufacture

Solution Approach 1:

The guide plate combines ceramic and metal materials, where the metal portion can be easily processed with standard drilling or laser techniques to form through-holes, while the ceramic portion provides the required mechanical strength and wear resistance. This composite approach simplifies the manufacturing process compared to forming through-holes entirely in ceramic material.

Inventive Principle:

Principle #40Composite materials

3Ease of manufacture

If silicon material is used for the guide plate to enable easy through-hole formation by etching, then manufacturing is simplified, but mechanical strength and wear resistance are reduced

Engineering Contradiction:

Improvethrough-hole formation processVSAvoidguide plate mechanical strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The guide plate uses a composite structure where the metal material provides the necessary mechanical strength and wear resistance, while the through-holes are formed in the metal portion using standard drilling or laser techniques. This approach achieves easy manufacturability without sacrificing mechanical properties, unlike pure silicon construction.

Inventive Principle:

Principle #40Composite materials

4Ease of operation

If the guide plate covers the entire wafer surface, then probe positioning is simplified, but heat dissipation during burn-in tests is reduced

Engineering Contradiction:

Improveprobe positioningVSAvoidheat dissipation capability

Core Design Contradiction:

Ease of operationVSTemperature

Solution Approach 1:

The guide plate is designed with a localized structure that covers only the critical probe insertion areas rather than the entire wafer surface. This localized configuration maintains adequate probe positioning and guidance functionality while exposing more of the underlying metal substrate to facilitate heat dissipation during burn-in tests.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design enables precise and durable probe card performance with reduced probe insertion hole size and pitch, improved positional accuracy, and effective heat dissipation, addressing the limitations of previous materials and processes.

Implementation Method 1

A probe card design utilizing anodic oxide film material for the guide plates

Methodology Applied

Scientific EffectAnodic oxidation: Anodising

Implementation Method 2

enhanced heat dissipation by exposing metal surfaces

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS11619655B2Probe card for testing a pattern formed on a wafer

Publication Date: 2023.04.04 POINT ENG

AI summary

A probe card is configured to perform a circuit test on a wafer to realize a reduction in size and pitch of probe insertion holes. The probe card includes a first plate, a second plate coupled to a lower portion of the first plate, an upper guide plate provided on an upper surface of the first plate, a lower guide plate provided on a lower surface of the second plate, and a reinforcing plate coupled to at least a surface of each of the upper and lower guide plates. At least one of the upper and lower guide plates is made of an anodic oxide film material, and as viewed from above, the upper and lower guide plates and the reinforcing plate are configured to have smaller areas than the first and second plates, so that upper and lower surfaces of the first and second plates are exposed.