Anodization Apparatus with Dual Electrolyte Supply for Substrate Peeling
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Solution Overview
Problem
Current anodization technologies face challenges in forming porous layers on silicon surfaces with varying film qualities, which are essential for semiconductor substrate processing, as they often result in high mechanical strength, making substrate peeling difficult and leading to substrate reuse limitations.
Innovation Solution
The anodization apparatus employs a dual electrolyte supply system with different concentration electrolytes A and B, and distinct current supply to upper electrodes, allowing for the formation of porous layers with different characteristics on the central and outer peripheral portions of the semiconductor substrate, enabling controlled film quality and peeling functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional anodization technology is used to form porous layers on silicon surfaces, then porous layers can be formed, but the film quality varies and mechanical strength becomes too high, making substrate peeling difficult
Solution Approach 1:
The patent applies local quality by dividing the substrate into different regions (central portion and outer peripheral portion) and forming porous layers with different characteristics in each region. Different electrolyte concentrations and current densities are applied to different areas to create porous layers with varying mechanical strengths, allowing the peeling layer to have controlled peeling properties while other regions maintain structural integrity.
Solution Approach 2:
The patent changes physical and chemical parameters of the anodization process, specifically using different electrolyte concentrations (first electrolyte with first concentration, second electrolyte with second concentration) and different current densities applied to different portions of the substrate. These parameter changes enable control over the mechanical strength and peeling characteristics of the formed porous layers.
2Manufacturing precision
If high mechanical strength porous layers are formed, then film quality is improved, but substrate peeling becomes difficult and substrate reuse is limited
Solution Approach 1:
The patent creates local quality differences by forming a peeling layer with specific porous characteristics in certain regions of the substrate while maintaining different characteristics in other regions. This allows the peeling layer to have controlled mechanical strength that facilitates easy peeling when needed, while other regions maintain higher strength for structural support.
Solution Approach 2:
The patent segments the substrate into functionally different regions: a peeling layer region that is designed for easy removal after device layer manufacturing, and other regions that maintain structural integrity. This segmentation allows different portions of the same substrate to serve different functional purposes in the manufacturing process.
3Adaptability or versatility
If dual electrolyte supply system with different concentrations is used, then porous layers with different characteristics can be formed on central and outer peripheral portions, but device complexity increases
Solution Approach 1:
The patent segments the electrolyte supply system into separate channels for different electrolyte solutions, with separate supply units for the first electrolyte and second electrolyte. This segmentation allows independent control of electrolyte delivery to different regions of the substrate, enabling formation of porous layers with different characteristics while maintaining manageable system complexity through modular design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of porous layers with varying film qualities that function as peeling layers, facilitating substrate reuse without peeling or breakage during device layer manufacturing or bonding processes, thereby improving substrate utilization efficiency.
Implementation Method 1
a technology of forming porous layers on a silicon surface by anodization is known
Implementation Method 2
anodization process on a semiconductor substrate
Data Source
AI summary
According to one embodiment, a anodization apparatus includes: a first process tank used for an anodization process on a first portion of a substrate; a second process tank provided inside of the first process tank and used for the anodization process on a second portion of the substrate; a first electrolyte supply unit configured to supply a first electrolyte to the first process tank; a second electrolyte supply unit configured to supply a second electrolyte to the second process tank; a retainer configured to retain the substrate; a first electrode provided above the first process tank and/or the second process tank; and a second electrode provided below the first process tank and the second process tank.