Black Anodized Cooling Plate for Stable Reactor Temperature
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Solution Overview
Problem
Conventional air cooling and liquid cooling methods for reactor temperature control in plasma processes are inefficient, leading to temperature fluctuations and increased maintenance costs, as they struggle to effectively manage heat conduction and respond to temperature changes within the reactor.
Innovation Solution
A substrate processing apparatus featuring a black anodized aluminum plate as a temperature control portion, positioned below the substrate support to absorb radiant heat from the reaction space, allowing for direct temperature control without the need for separate cooling fluids, enhancing heat absorption and transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional air cooling or liquid cooling methods are used to control reactor temperature, then cooling function is provided, but temperature control precision deteriorates and device complexity increases
Solution Approach 1:
The patent replaces the conventional mechanical cooling systems (air cooling fans or liquid cooling circuits) with a radiant heat absorption system. The black anodized aluminum plate directly absorbs radiant heat from the plasma reaction space through thermal radiation, eliminating the need for complex mechanical cooling devices and achieving precise temperature control without mechanical intervention.
Solution Approach 2:
The patent changes the physical and chemical parameters of the temperature control surface by applying black anodization treatment to the aluminum plate. This surface treatment dramatically increases the emissivity and absorptivity parameters of the plate, enabling it to efficiently absorb radiant heat from the plasma reaction space and achieve precise temperature control.
2Temperature
If conventional air cooling or liquid cooling methods are used to control reactor temperature, then cooling function is provided, but device complexity and maintenance cost increase
Solution Approach 1:
The patent extracts the essential cooling function from the complex mechanical cooling systems and implements it through a simple radiant heat absorption plate. By removing the unnecessary mechanical components (cooling fans, liquid circuits, pumps), the system achieves temperature control with minimal device complexity and lower maintenance requirements.
Solution Approach 2:
The black anodized aluminum plate performs temperature control through passive radiant heat absorption. The system serves itself by directly absorbing heat from the plasma reaction space through thermal radiation without requiring external cooling media, pumps, or mechanical intervention, thereby simplifying the overall system architecture.
3Temperature
If cooling devices are installed on the outer surface of reactor, then cooling function is provided, but heat conduction efficiency deteriorates and response time increases
Solution Approach 1:
The patent replaces slow thermal conduction through reactor walls with direct thermal radiation absorption. The black anodized aluminum plate positioned in the reaction space directly absorbs radiant heat through electromagnetic radiation, providing immediate temperature control response without the time delay inherent in thermal conduction through solid walls.
Solution Approach 2:
The patent introduces a black anodized aluminum plate as an intermediary element between the plasma reaction space and the heat dissipation path. This intermediary plate efficiently absorbs radiant heat from the reaction space and transfers it to the reactor structure, serving as a thermal mediator that accelerates the overall heat management process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively stabilizes the reactor temperature during plasma processes, reducing temperature fluctuations and maintenance costs by absorbing and dissipating radiant heat, thereby improving temperature control and process efficiency.
Implementation Method 1
A substrate processing apparatus featuring a black anodized aluminum plate as a temperature control portion, positioned below the substrate support to absorb radiant heat from the reaction space
Implementation Method 2
forming a temperature control portion by anodizing the aluminum plate
Data Source
AI summary
A method of manufacturing a cooling device of a substrate processing apparatus includes: providing an aluminum plate having a through hole; forming a temperature control portion by anodizing the aluminum plate; and arranging the temperature control portion below a substrate support portion, wherein the temperature control portion is arranged so that a support rod of the substrate support portion passes through the through hole.