Anodized Aluminum LED Package for Heat Dissipation and Insulation
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Solution Overview
Problem
Conventional light emitting diode (LED) packages face challenges in effectively radiating heat, which leads to increased temperature and reduced lifespan, and are also difficult to manufacture due to integration of metal members with resins and reflective components.
Innovation Solution
A light emitting diode package featuring an Al substrate with a reflective cup and Al anodized film that divides the substrate into electrodes, providing superior heat radiation properties and simplifying the manufacturing process by forming integral components without the need for separate bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal members are integrated with resins to form substrate, then manufacturing complexity increases, but heat radiation area is reduced
Solution Approach 1:
The patent merges the substrate and reflective member into a single integrated Al substrate structure with a reflective cup formed directly on it. This eliminates the need for separate bonding processes between metal members and resins, reducing manufacturing complexity while maintaining full thermal contact area for heat radiation.
Solution Approach 2:
The patent uses anodized Al substrate that combines the thermal conductivity of aluminum with the insulating and reflective properties of the anodized layer. This composite structure provides both excellent heat radiation capability and electrical insulation in a single material system.
2Reliability
If metal members are fixed through resins, then electrical insulation is achieved, but thermal conduction path is interrupted
Solution Approach 1:
The patent applies local quality by creating anodized regions specifically where electrical insulation is needed, while maintaining non-anodized Al substrate regions for optimal thermal conduction. The Al anodized film extends through the substrate to divide bottom surface into electrodes, providing insulation only where required for electrical separation.
Solution Approach 2:
The Al anodized film acts as an intermediary that provides both electrical insulation and thermal conduction pathways. It allows the substrate to maintain electrical isolation between different electrodes while preserving continuous thermal contact with the LED chip for efficient heat removal.
3Manufacturing precision
If separate bonding processes are used for substrate integration, then component precision is improved, but manufacturing time increases
Solution Approach 1:
The substrate and reflective member are merged into a single integral structure formed by processing the Al substrate directly. This eliminates multiple bonding steps and alignment operations, significantly reducing manufacturing cycle time while maintaining precise geometric relationships between components.
Solution Approach 2:
The reflective cup structure is pre-formed on the Al substrate during substrate fabrication itself, before LED chip mounting. This preliminary integration of the reflective surface eliminates the need for separate alignment and bonding operations that would otherwise be required to position reflective members precisely.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat radiation efficiency and reduces manufacturing complexity, extending the LED's lifespan and improving light emitting efficiency through effective heat transfer and integral component formation.
Implementation Method 1
an Al anodized film extending through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes
Implementation Method 2
the heat is radiated outside through the metal members 1b of the substrate 1
Implementation Method 3
the LED package should effectively radiate the high-temperature heat generated from the LED
Data Source
AI summary
A light emitting diode package which is superior in heat radiation and easily manufacturable. In the light emitting diode package, an Al substrate has a reflective cup formed thereon. At least one light emitting diode chip is disposed on a bottom surface of the reflective cup. An Al anodized film extends through the Al substrate to divide the bottom surface of the reflective cup into a plurality of substrate electrodes. Here, at least one of the substrate electrodes is surrounded by the Al anodized film. Also, the substrate electrodes are connected to a light emitting diode chip, respectively.